High Performance Transient Voltage Protection With Devices That Meet the Latest High Bandwidth Requirements

Key Features:

•  Market leading transient-clamping performance
•  Ultra-low capacitance for high-speed data lines
•  ESD, IEC61000-4-2, up to ±30kV (contact/air)
•  Lightning surge rated up to 150A, 8x20µs
•  Discretes and space-saving arrays (up to 14 channels)
•  Form factors as small as 0201 (0.6mm x 0.3mm)

How Do They Work?

Littelfuse TVS diode arrays, provide high level protection against ESDs, Electromagnetic Interferences (EMI), Electrical Fast Transients (EFT) and Lightning, mainly for sensitive digital and analogue input circuits, on data, signal, or control lines operating on power supplies.

SPA's work in two ways, first, they absorb transients with diodes, to steer the current, and then, an avalanching or zener diode, clamps the voltage levels. This prevents the device from exceeding its voltage rating. During over-voltage fault conditions, the device must have a low clamp voltage at the specified current wave form to protect sensitive IC's and ports.

In normal operation, the reverse stand off voltage must be higher than the equipment supply/working voltage, with low leakage current to prevent power supply loading. The device capacitance must be low enough to reduce input signal distortion. The device package must have a small footprint and low height to enable a high density Printed Circuit Board (PCB) layout.

The device must withstand multiple ESD/EFT pulses as specified in the IEC 61000-4-2.

What Is A Transient Voltage Event And Why Should I Be Concerned?

Voltage Transients are defined as short duration surges of electrical energy and are the result of the sudden release of energy previously stored or induced by other means, such as heavy inductive loads or lightning. In electrical or electronic circuits, this energy can be released in a predictable manner via controlled switching actions, or randomly induced into a circuit from external sources.

Repeatable transients are frequently caused by the operation of motors, generators, or the switching of reactive circuit components. Random transients, on the other hand, are often caused by Lightning and Electrostatic Discharge (ESD). Lightning and ESD generally occur unpredictably, and may require elaborate monitoring to be accurately measured, especially if induced at the circuit board level. Numerous electronics standards groups have analyzed transient voltage occurrences using accepted monitoring or testing methods. The key characteristics of several transients are shown in the table below.

Why are Transients of Increasing Concern?

Component miniaturization has resulted in increased sensitivity to electrical stresses. Microprocessors for example, have structures and conductive paths which are unable to handle high currents from ESD transients. Such components operate at very low voltages, so voltage disturbances must be controlled to prevent device interruption and latent or catastrophic failures.

Sensitive microprocessors are prevelant today in a wide range of devices. Everything from home appliances, such as dishwashers, to industrial controls and even toys use microprocessors to improve functionality and efficiency.

Most vehicles now also employ multiple electronic systems to control the engine, climate, braking and, in some cases, steering, traction and safety systems.

Many of the sub- or supporting components (such as electric motors or accessories) within appliances and automobiles present transient threats to the entire system.

Careful circuit design should not only factor environmental scenarios but also the potential effects of these related components. Table 2 below shows the vulnerability of various component technologies.

Series Name	Schematic (Example)	ESD Level (Contact)	I/O Cap	vRWM	Lightning (tP=8/20μs)	Number of Channels	Package Options
General Purpose ESD Protection Protection for human interfaces (keypads, buttons, switches, audio ports, etc)
SP1043		±12 kV	8 pF	6 V	1 A	1	01005 Flipchip
SP3145		±20 kV	0.35 pF	3.3 V	1 A	1	01005 Flipchip
SP1003		±25 kV	30 pF (17 pF @ 2.5 V)	5 V	7 A	1	SOD882
							SOD723
SP1044		±30 kV	3 0pF	6 V	3 A	1	01005 Flipchip
SP1006		±30 kV	25 pF (15 pF @2.5 V)	6 V	5 A	1	μDFN-2
SPHV Series*		±30 kV	25-60 pF	12-36 V	8 A	1	SOD882
SD Series		±30 kV	50-350 pF	5-36 V	30 A	1	SOD323
SP1007		±8 kV	5 pF (3.5 pF @ 5 V)	6 V	2 A	1	0201
							Flipchip
SP1002		±8 kV	6 pF (5 pF @ 2.5 V)	6 V	2 A	1	SC70-3
						2	SC70-5
SP24-01WTG-C-HV		±10 kV	10 pF	36 V	1.5 A	1	Flipchip
SP1014		±12 kV	6 pF	5 V	2 A	1	Flipchip
SP1021		±12 kV	6 pF	6 V	2 A	1	01005 Flipchip
SP1008		±15 kV	9 pF(6 pF @ 5 V)	6 V	2.5 A	1	0201
							Flipchip
SP24-01WTG-C-HV		±18 kV	13 pF	24 V	3 A	1	Flipchip
SM24CANA*		±24 kV	11 pF	24 V	3 A	2	SOT23-3
SP1026		±30 kV	1 5pF	6 V	5 A	1	μDFN-2 (0201)
SP1020		±30 kV	20 pF	6 V	5 A	1	01005 Flipchip
SP15-01WTG-C-HV		±30 kV	21 pF	15 V	5 A	1	Flipchip
SP12-01WTG-C-HV		±30 kV	26 pF	12 V	8 A	1	Flipchip
SP1013		±30 kV	30 pF	5 V	8 A	1	Flipchip
SP1005		±30 kV	30 pF (23 pF @ 2.5 V)	6 V	10 A	1	0201
SM24CANB*		±30 kV	30 pF	24 V	10 A	2	SOT23-3
SM712*		±30 kV	75 pF	-7 V to +12 V	19 A	2	SOT23-3
SM Series*		±30 kV	400 pF	5-36 V	24 A	2	SOT23-3
SD-C Series		±30 kV	200 pF	5-36 V	30 A	1	SOD323
SP1004	(4 Channel Shown)	±8 kV	6 pF (5 pF @ 1.5 V)	6 V	2 A	4	SOT953
SP1012		±15 kV	6.5 pF	5 V	3 A	5	Flipchip
SP1001		±15 kV	12 pF (8 pF @ 2.5 V)	5.5 V	2 A	2	SC70-3
							SOT553
						4	SC70-5
							SOT553
						5	SC70-6
							SOT563
							SOT963
SP1011		±15 kV	12 pF (7 pF @ 2.5 V)	6 V	2 A	4	μDFN-6 1.25x1.0mm
SP050xBA		±30 kV	50 pF (30 pF @ 2.5 V)	5.5 V	N/A	2	SOT23-3
							SC70-3
						3	SOT143
						4	SOT23-5
							SC70-5
						5	SOT23-6
							SC70-6
						6	MSOP-8
SP1015		±20 kV	5 pF	5 V	2 A	4	0.95X0.55MM Flipchip
New SP1064		±15 kV	8.5 pF	60 V	2 A	4	μDFN-10 2.5x1.0 mm
Series Name	Schematic (Example)	ESD Level (Contact)	I/O Cap	vRWM	Lightning (tP=8/20μs)	Number of Channels	Package Options
General Purpose ESD Protection (SCR Diode Arrays)
SP721		±4 kV	3 pF	30V or (±15V)	3 A	6	SOIC-8
							PDIP-8
SP720		±4 kV	3 pF	30V or (±15V)	3 A	14	SOIC-16
							PDIP-16
SP724		±8 kV	3 pF	20V or (±10V)	3 A	4	SOT23-6
SP723		±8 kV	5 pF	30V or (±15V)	7 A	6	SOIC-8
							PDIP-8
SP725		±8 kV	5 pF	30 V or (±15V)	14 A	4	SOIC-8
Series Name	Schematic (Example)	ESD Level (Contact)	I/O Cap	vRWM	Lightning (tP=8/20μs)	Number of Channels	Package Options
Low Capacitance ESD Protection Protection for data lines (USB, HDMI, eSata, etc)
SESD		±20 kV	0.25 pF	7 V	2 A	1	0201 DFN*
							0402 DFN*
		±22 kV	0.30 pF	7 V	2.5 A	1	0402 DFN
New SP3530		±22 kV	0.30 pF	7 V	2.5 A	1	0201 DFN*
							SOD882*
SP3021		±8 kV	0.50 pF	5 V	2 A	1	SOD882
SP3118		±10 kV	0.30 pF	18 V	2 A	1	0201 Flipchip
							SOD882
SP3130		±10 kV	0.30 pF	28 V	2 A	1	0201 Flipchip
							SOD882
SP3031		±10 kV	0.80 pF	5 V	2 A	1	SOD882
SP3022		±20 kV	0.35 pF	5.3 V	3 A	1	0201 Flipchip
							SOD882*
SESD		±20 kV	0.13 pF	±7 V	2 A	1	0201 DFN*
							0402 DFN*
		±22 kV	0.15 pF	7 V	2.5 A	1	0402 DFN
New SP3522		±22 kV	0.15 pF	7 V	2.5 A	1	0201 DFN*
							SOD882*
New SP3042		±30 kV	0.35 pF	5.3 V	2 A	1	01005 Flipchip
SP0502B*	(4 Channel Shown)	±15 kV	1 pF	5 V	2 A	2	SOT523
SESD		±20 kV	0.20 pF	7 V	2 A	2	0402 DFN
						4	0802 DFN
						4	1004 DFN*
						6	1103 DFN
		±22 kV	0.30 pF	7 V	2.2 A	2	0402 DFN
						4	1004 DFn
New SP3222-02ETG		±30 kV	0.90 pF	3.3 V	3 A	2	SOD883
SP1255*		±12 kV	0.50 pF (1300 pF Pin 1)	4 V (12 V Pin 1)	4 A (100 A Pin 1)	3	μDFN-6
SP3001		±8 kV	0.65 pF	6 V	2.5 A	4	SC70-6
SP3003		±8 kV	0.65 pF	6 V	2.5 A	2	SC70-5
							SOT553
							μDFN-61.6x1.0mm
						4	SC70-6
							SOT563
						8	MSOP-10
SP3004		±12 kV	0.85 pF	6 V	4 A	4	SOT563
SP0504SHTG		±12 kV	0.85 pF	6 V	4.5 A	4	SOT23-6
SP3002		±12 kV	0.85 pF	6 V	4.5 A	4	SC70-6
							SOT23-6
							μDFN-61.6x1.6mm
SP3014		±15 kV	1.0 pF	5 V	8 A	2	μDFN-6L 1.65x1.05mm
SP8142-04UTG		±22 kV	1.0 pF	5 V	2.5 A	4	μDFN-10 2.5X1.35mm
SP0524PTUG		±12 kV	0.50 pF	5 V	4 A	4	μDFN-10 2.5x1.0mm
SP0544TUTG
SP3012-4
New SP3422-04UTG		±22 kV / -10 kV	0.20 pF	5 V	2 A	4	μDFN-5
SP8143-06UTG		±22 kV	1.0 pF	5 V	2.5 A	6	μDFN-16
SP3010		±8 kV	0.45 pF	6 V	3 A	4	μDFN-10 2.5x1.0mm
SP3011		±8 kV	0.40 pF	6 V	3 A	6	μDFN-14 3.5x1.35mm
SP3012-6		±12 kV	0.50 pF	5 V	4 A	6	μDFN-14 3.5x1.35mm
SP7538PUTG		±12 kV	0.50 pF	5 V	4 A	8	μDFN-9
New SP8008		±30 kV	0.30 pF	5 V	4 A	8	μDFN-14
Series Name	Schematic (Example)	ESD Level (Contact)	I/O Cap	vRWM	Lightning (tP=8/20μs)	Number of Channels	Package Options
Lightning Surge Protection Protection for broadband data and communication lines (Ethernet, xDSL, etc)
SP1555		±30 kV	800 pF	15 V	120 A	1	μDFN - 6 1.8x2.0 mm
SP1255-01UTG*		±30 kV	1300 - 2500 pF	13.5 V	160 A	1	μDFN - 6 1.8x2.0 mm
SP3312*		±30 kV	1.3 pF	3.3 V	15 A	4	μDFN-8
SP4022*	Undirectional	±30 kV	1.3 pF	12 V	15 A	1	SOD323
SP4023*		±30 kV	1.3 pF	15 V	12 A	1	SOD323
SP4024*		±30 kV	1.3 pF	24 V	7 A	1	SOD323
SP4022-C*	Bidirectional	±30 kV	1.3 pF	12 V	15 A	1	SOD323
SP4023-C*		±30 kV	1.3 pF	15 V	12 A	1	SOD323
SP4024-C*		±30 kV	1.3 pF	24 V	7 A	1	SOD323
SLVU2.8		±30 kV	2 pF	2.8 V	40 A	1	SOT23-3
SLVU2.8
SLVU2.8-8		±30 kV	2.6 pF	2.8 V	30 A	8	SOIC-8
SP2502LBTG		±30 kV	5 pF	2.5 V	75 A	2	SOIC-8
SP4040
SR05		±30 kV	8 pF	5 V	25 A	2	SOT-143
LC03-3.3		±30 kV	9 pF	3.3 V	150 A	2	SOIC-8
SP4042		±30 kV	11 pF	3.3 V	95 A	2	μDFN-10 (2.6x2.6mm)
SP03-3.3		±30 kV	16 pF	3.3 V	150 A	2	SOIC-8
SP03-6		±30 kV	16 pF	6 V	150 A	2	SOIC-8
SP4044*		±30 kV	1.5 pF	2.8 V	24 A	4	MSOP-10
SP4045*				3.3 V
SLVU2.8-4		±30 kV	2 pF	2.8 V	40 A	4	SOIC-8
SRV05-4		±20 kV	2.4 pF	6 V	10 A	4	SOT23-6
SP3050
SP2504NUTG		±30 kV	3.5 pF	2.5 V	20 A	4	μDFN-10 (2.6x2.6)
SP4061
SP3304NUTG		±30 kV	3.5 pF	3.3 V	20 A	4	μDFN-10 (2.6x2.6)
SP4062
New SP2555NUTG		±30 kV	2.5 pF	2.5 V	45 A	4	μDFN-10 (3.0x2.0mm)
SP2574NUTG		±30 kV	5.0 pf	2.5 V	40 A	4	μDFN-10 (3.0x2.0mm)
SRDA05		±30 kV	8 pF	5 V	30 A	4	SOIC-8
SP4060		±30 kV	4.4 pF	2.5 V	20 A	8	MSOP10
SP4065				3.3 V
Series Name	Schematic (Example)	ESD Level (Contact)	I/O Cap	vRWM	EMI Filter Attenuation	Number of Channels	Package Options
ESD and EMI Filter Devices - Protection for mobile device display interfaces (mobile phones, navigation devices, etc)
SP5001	(4 Channel Shown)	±15 kV	1.3 pF	5 V	30 dB @ 800 MHz	4	TDFN-10 2.5X2.0mm
SP5002		±15 kV	1.3 pF	5 V	30 dB @ 800 MHz	6	TDFN-16 4.0X2.0mm
SP5003		±15 kV	1.3 pF	5 V	16 dB @ 900 MHz	4	TDFN-10 2.5X2.0mm
SP6001	(4 Channel Shown)	±30 kV	24 pF (CDIODE=12 pF)	6 V	≥ -30 dB @ 1 GHz	4	μDFN-8 1.7x1.35mm
						6	μDFN-12 2.5x1.35mm
						8	μDFN-16 3.3x1.35mm
SP6002		±30 kV	30 pF (CDIODE=15 pF)	6 V	≥ -30 dB @ 1 GHz	4	μDFN-8 1.7x1.35mm
						6	μDFN-12 2.5x1.35mm

Note: * AEC-Q Automotive Qualified Part

Datasheets

To view a datasheet click here to visit our part search and choose the appropriate series.

TVS Diode Array (SPA® Family) Catalog

Littelfuse SPA Devices are designed to protect electronics from very fast and often damaging voltage transients, such as lightning and electrostatic discharge (ESD). They offer an ideal protection solution for I/O interfaces and digital and analog signal lines, in computer and consumer portable electronics markets.

Littelfuse SPA Devices are available in a range of packaging configurations including DIP, SOIC, MSOP, SOT23, SOT143, SC70, SOT5x3, SOT953, μDFN, SOD723, and flipchip. View catalog.

AEC-Q101 TVS And Diode Arrays Selection Guide

This selection guide focus’s around automotive applications and the products meeting the qualifications within the product categories of TVS Diode Arrays and TVS Diodes.

Application Note: Designing Protection Solutions for 10GbE/1BbE and PoE using SP4044-04ATG/SP4045-04ATG TVS Diode Arrays

The Littelfuse SP4044 and SP4045 Series TVS (Transient Voltage Suppressor) Diode Arrays offer circuit designers overvoltage solutions for 10GbE or 1GbE interfaces in small form factor SMT (Surface Mount Technology) MSOP-10 packages. These components combine the advantages of low off-state capacitance load and low dynamic resistance with a robust surge rating.

Guide for Port Protection: System-Level and Application Specific Electrostatic Discharge (ESD) Suppression Design Guide

Designers of today's electronic devices have demanded more functionality with greater flexibility and higher levels of user interaction. These circumstances have helped in driving the development of nanometer chipsets along with a multitude of user interfaces or ports. The confluence of these two has made electronic devices more susceptible to ESD and required the need for a more robust solution. View guide.

Application Note: Selecting an Appropriate ESD Device

Board designers today are confronted with a multitude of choices for ESD protection. Often the designer is constrained by certain limits such as the amount of parasitic capacitance his/her application can withstand or the required ESD level the board must pass without fail. More often than not, the constraints do not narrow down the available number of ESD devices to a manageable list. This white paper will provide guidance to the designer that will help him/her in choosing an ESD device that will give the best chance of a successful first pass design. View application note.

Application Note: Tips for Enhancing ESD Protection

In this white paper we'll address various techniques a board designer can employ to help him/her attain the ESD level required for their design should the chosen ESD protection devices fail in-system ESD testing. View application note.

Application Note: USB3.0 Port ESD Circuit Protection

This article explains the issues in greater detail and shows USB3.0 eye diagram test results to prove why the right kind of silicon protection array is the best technology for protecting USB 3.0 applications against ESD. View application note.

Application Note: Ethernet Port Lightning, ESD and EFT Protection

Understanding the nature and "directionality" of the events listed above will help guide the designer in how to best protect an Ethernet port, and more importantly, how the device's pin connections will affect system performance. View application note.