Titanium Ti375C529 FPGA Device

Efinix's Titanium FPGAs are fabricated in a 16 nm process, delivering high performance with low power and tiny physical size. With a wide range of logic element (LE) densities from 35,000 to 1 million and compatibility with Efinix's RISC-V system on chip (SoC) cores, Titanium devices help turn a tiny chip into an accelerated embedded computing system. The Quantum computing fabric in the Titanium Ti375 FPGA comprises configurable tiles, the exchangeable logic and routing (XLR) cell that optimizes routing efficiency and speed while achieving high utilization ratios. The fabric also has highly configurable 10K embedded memory blocks and dedicated, high-speed DSP blocks. These features deliver optimum application performance, from edge computing to industrial automation and video processing. The 16 nm process node gives Titanium FPGAs a small footprint with low power consumption.

These Titanium devices' powerful I/Os allow the user to interface to processors or camera sensors with traditional LVDS or high-speed I/O (HSIO) that can be configured as MIPI at up to 1.5 Gbps. The high-performance fabric of the Ti375, with 370K logic elements, supports processing capability using personalized RTL algorithms or a high-performance RISC-V processor for a more traditional approach. Ti375 class devices in the 529-BGA package feature a hardened quad-core 32-bit RISC-V processor complex featuring the RISCV32I ISA with M, A, C, F, and D extensions. Peripherals for the processor block are configurable in the Efinity tool IP manager, resulting in the high performance of a hardened processor and the efficiency of a software-defined block. The Ti375 contains two hardened LPDDR4/4X memory controllers with x32 or x16 bus widths for high-speed access to external memory.

The Ti375’s 529-ball BGA is 19 mm x 19 mm with a 0.8 mm ball pitch. It exposes 51 high-voltage I/Os (HVIO) with capabilities up to 3.3 V and 176 HSIOs that can be used as single-ended I/Os, differential pairs, or MIPI channels.