PLCC Dip Chip Carrier Sockets 8400 Series

3M PLCC low-profile, four-row, through-hole 8400 series is a closed-frame style connector designed to accept chip carriers conforming to JEDEC outlines MO-047 (square) and MO-052 (rectangular). Available in two mounting types, surface-mount and through-hole, in pitches 0.050” (1.27 mm) and 0.100” (2.54 mm).

Features

• Automated compatibility: fully compatible with automated loading equipment for efficient assembly
• Open-top design: allows unrestricted airflow, enhancing cooling and performance
• Ease of use: molded slots facilitate straightforward device extraction
• Wave solder compatible: designed for wave soldering processes; not suitable for reflow soldering
• RoHS compliant: meets environmental regulations; refer to the Regulatory Information Appendix for chemical compliance details
• Position configurations options:
  • 20 (4x5)
  • 28 (4x7)
  • 32 (2x7 and 2x9)
  • 44 (4x11)
  • 52 (4x13)
  • 68 (4x17)
  • 84 (4x21)