Data mining analytics and machine learning applications have spurred the development of technology that allows faster GPU/ASIC processing speeds while increasing the quantities of these devices per line card all of which results in high component and power densities.

CASE STUDY: BOND PLY Increases Production Efficiency, Lowers Cost for High-Power Industrial Application.

As the industry transitions to new 5G-capable designs, Henkel’s applications expertise, formulation know-how and proven product performance will deliver once again for the telecom sector.

Henkel LOCTITE® Bergquist® is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Henkel PSRA NA has decided to discontinue the use of HMIS ratings on SDSs and labels. This change will be phased in beginning at the end of 2013 and fully effective June 1, 2015.

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

The LOCTITE GC solder paste platform changes everything. Uniquely stable flux chemistry delivers unprecedented performance and is the basis of all LOCTITE GC materials, including the award-winning LOCTITE GC 10 and LOCTITE GC 3W.

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Henkel has regrouped their product offering and introduced a simplified branding approach.

Material Leader’s Latest Solder and Thermal Management Solutions Take Home Top Honors

Thermal Solutions for Any Application

Epoxy flux technology tacky flux with value added benefits from Multicore.

Recently, the focus of attention in the IC packaging industry has been squarely on removing costs from the manufacturing supply chain

Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.

Henkel today announced the launch and commercial availability of its latest thermal product, PowerstrateXtreme™ Dispensable (PSX-D)

Electronics Assembly Solutions

Henkel's solder materials science gets small as miniaturization challenges old rules.

Though the electronics industry is nearing the three-year anniversary marking the ban of lead from electronics products, several challenges remain with existing lead-free materials for certain applications from Henkel.