Fast boot loaders for autonomous driving systems and instrument panel displays, AI training model, database storage systems, and over-the-air programming updates for gaming all have one thing in common - an ever-growing need for more Flash memory.
Winbond showcases the latest memory technologies and applications at electronica 2024.
Winbond’s advanced DRAM and Flash memory solutions, which are crucial for AIoT and embedded AI applications. Additionally, the TrustME® Secure Flash is presented, ensuring robust security for AI systems.
Winbond brings you high quality and high performance for these automotive-grade memory solutions, including Mobile DRAM, Specialty DRAM, Code Storage Flash and TrustME Secure Flash.
A specialized processor and software library offer a simpler, safer alternative for face-based authentication.
Designers can use a wireless SoC’s specialized power management technology to support continuous Wi-Fi connectivity at minimal current levels.

Winbond's W25Q512JV (512 Mb) serial Flash memory provides a storage solution for systems with limited space, pins, and power.

This presentation will review the operation, performance and use cases for serial flash interfaces while concentrating on Serial Peripheral Interface or SPI.
Duration: 5 minutesDevelopers can rapidly implement machine learning based speech and object recognition designs using MicroPython and a neural network processing module.

This presentation will highlight Winbond’s SDRAM Memory Basic Introduction.
Duration: 10 minutesThe Industrial IoT requires designers to pay particular attention to architecture, device reliability and robustness, and connectivity.

Winbond’s SLC NAND Flash products are direct drop-in replacements to the ONFi SLC NAND products available in the industry from different suppliers and the products are compatible.

Winbond is one of the world’s major DRAM suppliers focusing on embedded designs and mobile markets.

Winbond's W25X and W25Q SpiFlash® multi-I/O memories feature the popular serial peripheral interface (SPI), densities from 512 K-bit to 512 M-bit, small erasable sectors and the industry's highest performance.
IoT apps demand connectivity straddling both industrial and consumer communications requirements. Multi-standard wireless MCUs now offer more these options.
Analog transducers and sensors do a good job of translating a real world physical condition into an electronic signal that we can measure and use.
Digi-Key Corporation and Winbond Electronics Corporation America announce the expansion of the companies' current distribution agreement to include Europe.

Winbond Electronics Corporation America (WECA) was founded in 1990. It is the sales, marketing and design arm for Winbond Electronics Corporation, headquartered in Science-Based Industrial Park, Hsinchu, Taiwan.