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Winbond Electronics Corporation
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Green Manufacturing: A Strategic Imperative for Environmental Sustainability
Green manufacturing minimizes environmental impact through energy efficiency, waste reduction, and resource optimization. Companies must adopt renewable energy, reduce emissions, and manage waste efficiently. Clean energy investments enhance sustainability and regulatory compliance. These efforts improve operational efficiency while driving cost savings.
Low Density of LPDDR4x DRAM – the Best Choice for Edge AI
The edge AI chipset market will surpass cloud AI in 2025, driven by real-time processing needs. AIoT devices require dedicated accelerators and low-power DRAM for efficiency. Winbond’s LPDDR3 and LPDDR4x offer high bandwidth with low power, supporting AI inference in edge devices.
High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices
Winbond’s W25QxxRV NOR Flash offers low power consumption, high-speed performance, and a compact design—perfect for industrial, automotive, consumer, and IoT devices. With faster read speeds, quicker programming, and support for extreme temperatures, it raises the bar for memory efficiency and reliability.
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About Winbond Electronics Corporation
Winbond Electronics Corporation is one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. The Company provides customer-driven solutions backed by the expert capabilities of product design, R&D, manufacturing, and promoting brand name products globally. Winbond’s product portfolio, consisting of Code Storage Flash, TrustME® Secure Flash, Customized Memory Solution (CMS), is widely used by tier 1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. With its 12-inch fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park, Winbond keeps pace to develop in-house technologies to provide high-quality integrated circuit products and services.
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PRESS RELEASES
- Winbond Earns ISO/SAE 21434 Certification for W77Q Secure Flash, Becoming the World's First Memory IC Vendor to Achieve this Milestone
- Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0
- Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
- Winbond Introduces the Next Generation 8Mb Serial Flash for Edge Devices in Space Constrained IoT Applications
- Winbond Introduces the Next Generation 8Mb Serial Flash – W25Q80RV for Low Power and Small Form Factor IoT Devices
- Winbond joins STMicroelectronics Partner Program to Combine High-Performance Memory with STM32 Devices in Smart Industrial and Consumer Applications
- Winbond joins UCIe Consortium to Support High-Performance Chiplet Interface Standardization
- Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
- Winbond Sets Global Sustainability Standard with Sustainability Initiatives and Products
- Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
Hong Kong, China