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8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 8/27/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
8
Tantalum Surface Mount Capacitors – High Reliability
T513 Commercial Off-The-Shelf (COTS) Multiple Anode Low ESR COTS MnO2
Soldering Process
KEMET’sfamiliesofsurfacemountcapacitorsare
compatible with wave (single or dual), convection, IR,
orvaporphasereflowtechniques.Preheatingofthese
components is recommended to avoid extreme thermal
stress.KEMET'srecommendedprofileconditionsfor
convectionandIRreflowreflecttheprofileconditionsofthe
IPC/J–STD–020D standard for moisture sensitivity testing.
Thedevicescansafelywithstandamaximumofthreereflow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstandwavesoldering,thetallprofile(4.3mmmaximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
difficultyinprocesscontrol.Ifperformed,careshouldbe
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reflowoccurs.Oncereflowoccurs,theironshouldbe
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Duringtypicalreflowoperations,aslightdarkeningofthe
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Profile Feature SnPb Assembly
Temperature Minimum (TSmin)100°C 150°C
Temperature Maximum (TSmax)150°C 200°C
Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
to T
)3°C/secondsmaximum 3°C/secondsmaximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (t
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)
Timewithin5°CofMaximum
Peak Temperature (tP)
20 seconds maximum 30 seconds maximum
Ramp-down Rate (TP to TL)6°C/secondsmaximum 6°C/secondsmaximum
Time25°CtoPeak
Temperature
6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation
on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip
stock should be used promptly, preferably within three years of receipt.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
tP
tL
ts
25°C to Peak