Settings
Fast Delivery
Free Shipping
Incoterms
Payment Types
Marketplace Product
Slide 1
Slide 2
Slide 3
Slide 4
Slide 5
Slide 6
Slide 7
Slide 8
Slide 9
Slide 10
Slide 11
Slide 12
Slide 13
Slide 14
Slide 15
Slide 16
Slide 17
Slide 18
Slide 19
Slide 20
Slide 21
Slide 22
Slide 23
Product List
The Part Average Test is performed when the device is tested at die level, at the electrical wafer sort testing step (EWS), and at the final test after the device has been assembled. PAT at the EWS requests three different types of tests: dynamic, geographic, and wafer map stacking. These tests will be discussed on the following slides.
PTM Published on: 2012-10-16
Hong Kong, China