cms-photo-not-available
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

KU-PA-ST-3-5,5MMDM-651-SG

DigiKey Part Number
59-KU-PA-ST-3-5,5MMDM-651-SG-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
KU-PA-ST-3-5,5MMDM-651-SG
Description
KU-PA-ST-3-5,5MMDM-651-SG
Manufacturer Standard Lead Time
8 Weeks
Customer Reference
Detailed Description
Heat Sink
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bulk
Part Status
Active
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

Available To Order
Check Lead Time
This product is not kept in stock at DigiKey. The lead time shown will apply to the manufacturer’s shipment to DigiKey. Upon receiving the product, DigiKey will ship to fill open orders.
Quantity
All prices are in HKD
Bulk
QuantityUnit PriceExt Price
5,000$1.45745$7,287.25
Manufacturers Standard Package
You May Also Be Interested InSee All
4 Items
TC3-1G

TC3-1G

HEAT SINK THERMAL COMPOUND

Chip Quik Inc.

$48.86000
TC1-10G

TC1-10G

HEAT SINK COMPOUND - HIGH DENSIT

Chip Quik Inc.

$73.49000
TC4-20G

TC4-20G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.

$454.56000
1978-DP

1978-DP

SILICONE FREE HEAT SINK COMP.

Techspray

$306.60000