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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B60023G | |
|---|---|
DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Bulk | Power Dissipation @ Temperature Rise 1.5W @ 50°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Solder Anchor | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 1,983
Check for Additional Incoming Stock
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Quantity
All prices are in HKD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $30.50000 | $30.50 |
| 10 | $26.97500 | $269.75 |
| 25 | $25.69400 | $642.35 |
| 50 | $24.76480 | $1,238.24 |
| 216 | $22.91324 | $4,949.26 |
| 432 | $22.08368 | $9,540.15 |
| 648 | $21.61215 | $14,004.67 |
| 1,080 | $21.03189 | $22,714.44 |
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