



374324B60023G | |
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DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 6 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Type | Description | Select All |
---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Solder Anchor | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C | |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Base Product Number |
Quantity | Unit Price | Ext Price |
---|---|---|
1 | $29.88000 | $29.88 |
10 | $26.47400 | $264.74 |
25 | $25.22280 | $630.57 |
50 | $24.31080 | $1,215.54 |
216 | $22.49278 | $4,858.44 |
432 | $21.67836 | $9,365.05 |
648 | $21.21543 | $13,747.60 |
1,080 | $20.64578 | $22,297.44 |