374324B60023G
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374324B60023G
374324B60023G
374324B60023G

374324B60023G

DigiKey Part Number
HS522-ND
Manufacturer
Manufacturer Product Number
374324B60023G
Description
BGA HEAT SINK
Manufacturer Standard Lead Time
6 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Bulk
Part Status
Active
Type
Board Level
Package Cooled
Attachment Method
Solder Anchor
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
1.5W @ 50°C
Thermal Resistance @ Forced Air Flow
6.00°C/W @ 500 LFM
Thermal Resistance @ Natural
30.60°C/W
Material
Material Finish
Black Anodized
Base Product Number
Product Questions and Answers

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In-Stock: 2,391
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$29.88000$29.88
10$26.47400$264.74
25$25.22280$630.57
50$24.31080$1,215.54
216$22.49278$4,858.44
432$21.67836$9,365.05
648$21.21543$13,747.60
1,080$20.64578$22,297.44
Manufacturers Standard Package