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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
In-Stock: 2,154
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
Quantity
All prices are in HKD
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $21.21000 | $21.21 |
| 10 | $18.74000 | $187.40 |
| 25 | $17.85080 | $446.27 |
| 50 | $17.20620 | $860.31 |
| 100 | $16.58460 | $1,658.46 |
| 250 | $15.79648 | $3,949.12 |
| 756 | $14.89358 | $11,259.55 |
| 1,512 | $14.35367 | $21,702.75 |
| 5,292 | $13.42560 | $71,048.28 |
Hong Kong, China