
TDK RF Components
Advancing Wireless Communication with Innovations
Mobile communication is one of the world's leading growth markets. As LTE mobile communication services (4G) are being rolled out around the world and with the emergence of 5G, smartphones must support even more frequency bands in addition to bands for existing 2G and 3G networks, driving the need for further miniaturized components. TDK is there every step of the way to help our customers design and create innovative products for the next evolution of the wireless world.
With state-of-the-art LTCC antennas, filters, diplexers, triplexers, couplers, baluns, and more, TDK's extensive portfolio of RF products provides key technologies and solutions for mobile phone technologies and other wireless protocols used in consumer products such as routers, streaming devices, wearable, etc. TDK products feature compact & low profile designs with case size as small as 0.65 x 0.50 mm while maintaining industry leading performance and reliability. TDK also offers an excellent library of design tools, selection guides, and application notes to help you choose the right product for your next design.
Antennas

TDK's ANT series ceramic chip antennas feature compact and low profile designs, with case sizes available as small as 1.6 x 0.8 mm at a thickness of just 0.4 mm. Even with their small size and thin profile, TDK antennas maintain high performance and reliability all with the industry’s smallest "keep-out" area on the PCB.
TDK antennas are capable of supporting multi-band applications including connectivity to mobile devices such as smartphones, tablets, wearables, IoT devices, smart meters, smart grids, HEMS, STBs, streaming devices, and game controllers.
Features
- Case Size: EIA 0603 ~ EIA 1008
- Frequencies: 900 MHz ~ 5.95 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°֯C
- Efficiency: Up to 80%
- Linear Polarization
- LTCC-based design
- Compact, low profile design
- High performance and reliability
- Capable of supporting multi-bands
- Smallest keep-out area in the industry
- Omni-directional
Applications
- 2.4 GHz & 5 GHz WiFi
- Bluetooth/BLE/Bluetooth Smart
- ZigBee
- GPS/GLONASS
- LTE B40/B41
- DSRC
- Automotive
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RF Filters

TDK's DEA series filters are designed using Low Temperature Co-fired Ceramic (LTCC) and create a resonance frequency allowing certain frequency ranges to pass while blocking, or attenuating, other unwanted frequency ranges. TDK offers both high and low pass filters, as well as band pass filters with frequencies ranging from 5MHz to 8GHz with variation in shape and size, terminal structure, specification values, etc.
TDK filters are used in products with a wide variety of wireless communications such as WLAN, BT, cellular, GPS, Zigbee, WiMAX and in both licensed and un-licensed frequencies. TDK works with chipset partners to design custom matched filters for specific chipsets as well as offering standard general use filters. TDK designs filters for different end products whether for low IL (energy saving) for battery operated devices and high attenuation/performance products for devices with a power connection.
Features
- Case Size: EIA 0202 ~ EIA 1008
- Frequencies: 5 MHz ~ 5.95 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- LTCC-based design
- Compact and high performance
- Stable characteristics
- Low loss
- High attenuation
- 2-in-1 Balun+Filter available
Applications
- 2.4 GHz & 5 GHz Wi-Fi
- Bluetooth
- ZigBee
- LTE
- GSM
- DCS/PCS
- UMTS
- WCDMA
- WiMAX
- ISM Bands
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Baluns

TDK’s HHM1xxx series, multilayer Low Temperature Co-fired Ceramic (LTCC) baluns, convert an unbalanced signal into a balanced signal or vice versa. The baluns can also be used for impedance matching to improve electronic circuit efficiency. TDK’s baluns are available in a wide range of configurations with frequencies ranging from 673 MHz to 5.95 GHz and dimensions ranging from 0.6 x 0.5 mm to 2.0 x 1.2 mm. They are ideal for use in WLAN, Bluetooth, LTE, and GSM applications.
Features
- Case Size: EIA 0202 ~ EIA 0805
- Frequencies: 673 MHz ~ 5.95 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- LTCC based design
- Wide Frequency band products available
- Targeted RF band specific, high performance products available
- Compact and high performance
- Standard case sizes and pin-outs for multi-band PCB designs
- Available in 50:50(ohms), 75:50, 100:50, and 200:50 as well as chipset specific configurations
Applications
- LTE/WCDMA/CDMA
- GSM
- Bluetooth
- Wireless LAN
- ZigBee
- WiMAX
- Near-Field Communication
- UWB
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Couplers

TDK’s HHM2xxx series multilayer directional couplers are used for signal monitoring and signal reporting without interrupting the main system power path. TDK’s couplers utilize a Low Temperature Co-fired Ceramic (LTCC) process and offer low insertion loss and high isolation. Couplers are available in a wide range of configurations with frequencies ranging from 450 MHz to 5.95 GHz and dimensions as small as 0.6 x 0. X 0.5 x 0.3 mm to as large as 1.6 x 0.8 x 0.6 mm. They are ideal for use in MIMO and CA designs for signal monitoring and controlling. Applications include WLAN, LTE, GSM/cellular and other frequencies where signal monitoring is required.
Features
- Wide Frequency band products available
- Targeted RF band specific, high performance products available
- Frequencies: 450 MHz ~ 5.95 GHz
- Case Size: EIA 0202 ~ EIA 0805
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- LTCC and based design
- Compact and low profile
- Low Insertion Loss
- High Isolation
- Available as a combination LPF-Coupler package as well as a 3 dB divider & power combiner versions
Applications
- 2.4 GHz & 5 GHz WLAN
- LTE/WCDMA/CDMA
- GSM
- Bluetooth/ZigBee
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Diplexers

TDK's DPX series diplexers are 3-port filters that divide/route two frequencies from a common port. TDK diplexers offer low insertion loss and high attenuation and are available in various combinations of LPF/BPF/HPF designs. With dimensions ranging from 1.0 x 0.5 mm to 2.5 x 2.0 mm, their compact size and high performance offers stable characteristics for applications including 2.4 GHz & 5 GHz Wi-Fi, Bluetooth, ZigBee, LTE and GPS.
TDK diplexers using Low Temperature Co-fired Ceramic (LTCC) are available in a wide product range with variations in frequency, size, terminal structure, specification values, etc.
Features
- Case Size: EIA 0402 ~ EIA 1008
- Frequencies: 570 MHz ~ 5.95 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- LTCC-based design
- Compact and high performance
- Stable characteristics
- Low loss Versions
- High Attenuation Versions
- Combinations of LP/BP/HP design
Applications
- 2.4 GHz & 5 GHz Wi-Fi
- Bluetooth
- ZigBee
- LTE
- LAA
- GSM
- DCS/PCS
- UMTS
- WCDMA
- WiMAX
- GPS
- UWB
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Triplexers

TDK's TPX series multilayer triplexers use the same Low Temperature Co-fired Ceramic (LTCC) material as our extensive line-up of diplexer and filter products. The newest of our filtering family, TPX Series triplexers are designed to support high functionality with low insertion loss and high attenuation all in a compact 8 terminal SMD package measuring 2.0 x 1.2 x 0.9 mm. TDK triplexers are used in the I/O part of the antenna and have functions to separate or combine three different frequency signals during transmission and reception. They are also used in CA (carrier aggregation) circuits. The TPX series is designed for applications using a combination of GPS/Dual-band Wi-Fi/Bluetooth/ZigBee for connectivity. Look for new TPX products to support additional band combinations.
Features
- Case Size: EIA 0805 ~ EIA 1210
- Frequencies: 450 MHz ~ 5.95 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- LTCC-based design
- Compact and high performance
- Stable characteristics
- Low loss
- High attenuation
- Matched to 50 Ohms
Applications
- 2.4 GHz & 5 GHz Wi-Fi
- Bluetooth
- ZigBee
- LTE
- LAA
- GSM
- DCS/PCS
- UMTS
- WCDMA
- WiMAX
- GPS
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Flexield Noise Suppression Sheets

TDK's IF series Flexield products are highly flexible, shock-resistant noise suppression sheets made of soft magnetic material and resin for thin and compact devices. Electromagnetic waves are converted to thermal energy by natural resonance in the soft magnetic materials contained in the sheet, which prevents the electromagnetic waves from being transmitted through the shield, or reflects the waves internally.
With an extensive lineup of products that deliver excellent permeability, Flexield allows designers to match impedance with ease and delivers excellent magnetic convergence. Flexield products are available in a variety of material combinations such as magnetic sheet only, magnetic sheets + copper conductive layer, with double-sided tape, etc. to better tailor to your application needs.
Features
- 0.025 mm to 0.20 mm material thickness
- Permeability @ 1 MHz: 100 ~ 220
- Surface Resistivity up to 1MΩ/sq min.
- Less reflection as compared to metal foil
- Can be cut into a wide range of dimensions and shapes
- Noise suppression without design change
Applications
- Smartphone
- Notebook
- Car Navigation
- RFID
- Optical Module
- Wireless LAN
- Automotive
- HDD
- Wireless Charging
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Thin-film RF Products

TDK’s TFS series products utilize TDK’s thin-film process technology, originally created for HDD R/W heads, to provide fine patterning, high precision and miniaturization. This technology is now used for RF components including filters, diplexers, couplers and baluns. With today’s market demand for smaller, thinner, high performing product, thin-film technology allows TDK to develop compact, low-profile RF components with outstanding performance. A key feature of the TFS product is the tight spec tolerances and reduced lot to lot variations. TFS Low Pass Filters are ideally suited to provide extra attenuation in a small case without taking up too much PCB real estate.
TDK TFS series products are ideally suited for use in cellular/LTE applications in smartphones and tablets and technologies such as WLAN, BT and GPS.
Features
- Case Size: EIA 0202 ~ EIA 0402
- Frequencies: 690 MHz ~ 5 GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ~ +85°C
- Available in LPF, BPF, HPF, Coupler and Balun designs
- Thin film based compact and low profile design
- Tight tolerances and tight lot to lot variations.
- High performance and reliability
- Low loss
- Stable characteristics
- Small case sizes for use in front end module applications
Applications
- LTE
- Wireless LAN
- WiMAX
- Bluetooth
- Navigation
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