STEVAL-BFA001V2B Predictive Maintenance and Condition Monitoring

STMicroelectronics' STEVAL-BFA001V2B is an industrial reference design kit designed for condition monitoring (CM) and predictive maintenance (PdM) in a layout designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications. The kit consists of an industrial sensor board and the necessary debugging tools, cables, plugs, and adapters for an industrial communications scenario. The STEVAL-BFA001V2B reference kit for condition monitoring and predictive maintenance is based on the high-performance industrial sensor platform. The compact design is especially suitable for monitoring motors, pumps, and fans.

The sensor platform embeds a high-performance Arm® Cortex®-M4 32-bit microcontroller (STM32F469AI), iNEMO 6DoF accelerometer and gyroscope (ISM330DLCTR), a barometric pressure sensor (LPS22HBTR), a relative humidity and temperature sensor (HTS221TR), a digital microphone (MP34DT05-ATR), EEPROM (M95M01-DF) for data storage, IO-Link PHY device (L6362A), and power management based on a step-down switching regulator and LDO regulator (L6984 and LDK220).

The STSW-BFA001V2 firmware package includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity, and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).

Features

• Main supply voltage 18 V to 32 V
• Main components
• 32-bit Arm Cortex-M4 core for signal processing and analysis (STM32F469AI)
• iNEMO 6DoF (ISM330DLCTR)
• Absolute digital pressure sensor (LPS22HBTR)
• Relative humidity and temperature sensors (HTS221TR)
• Digital microphone sensors (MP34DT05TR-A)
• IO-Link PHY device (L6362A)
• EEPROM (M95M01-DF) for data storage
• Step-down switching regulator and LDO regulator (L6984 and LDK220)
• Microphone algorithms
• M12 industrial connector
• SWD connector for debugging and programming capability
• IO-Link PHY using the L6362A device transceiver for data communication with host unit
• Compact solution for condition monitoring and predictive maintenance based on 3D digital accelerometer, environmental, and acoustic MEMS sensors
• Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance