THERM-A-GAP™ GEL45 Thermally Conductive Gel
Parker Chomerics' THERM-A-GAP GEL45 4.5 W/m-K thermally conductive gel
Parker Chomerics' THERM-A-GAP GEL45 is a fully cured dispensable thermal gel that has 4.5 W/m-K thermal conductivity. It is designed as a one component fully cured system with automated dispensing. This allows the elimination of time-consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.
- Easily dispensable
- Fully cured/no pump-out
- High bulk thermal conductivity
- Low thermal impedance
- Ultra-low compression force
- High-tack surface and reworkability
- Proven long-term reliability
- Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
- Proven reliability in extreme temperature cycling and shock and vibration
- Deflects easily under very low compressive forces, decreasing stress on components and thus decreasing component failures
- Accommodates a variety of bond line thicknesses for application to multiple devices
- GEL45 has been successfully used to fill a variety of different gap thickness
- High bulk thermal conductivity
- Excellent performance-to-price
- Compatible with high volume, automated dispense processes
- Meets Telcordia (Bellcore) silicone specifications
- Automotive electronic control units (ECUs)
- Power supplies and semiconductors
- Memory and power modules
- Microprocessors/graphics
- Processors
- Flat-panel displays and consumer electronics