The OSD335x C-SiP from Octavo is a self-contained computing system ideal for powering the latest embedded applications. It integrates the powerful 1 GHz Sitara™ Arm® Cortex®-A8 AM335x processor from Texas Instruments, up to 1 GB of DDR3L memory, up to 16 GB of embedded multimedia card (eMMC) non-volatile memory, a low power, low jitter MEMs oscillator, 4 KB EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors, and inductors into a single 27 mm x 27 mm, easy-to-use IC package.
With this level of integration, the OSD335x C-SiP has everything needed to build a complete embedded computing platform. It allows designers to focus on the key aspects of their system without spending time on the complications associated with getting the processing core working. It also reduces the overall size and complexity of the design while simplifying the supply chain. The OSD335x C-SiP can significantly decrease the time-to-market for any embedded computing products.
Features |
Benefits |
- TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS oscillator and passive components integrated into a single package
- TI AM335x features:
- Arm Cortex-A8 up to 1 GHz
- 8-channel 12-bit SAR ADC
- 2-port Ethernet 10/100/1000
- USB 2.0 HS OTG + PHY x2
- MMC, SD, and SDIO x3
- LCD controller
- SGX 3D graphics engine
- PRU subsystem
- Access to all AM335x peripherals (except those used for communicating with the eMMC): CAN, SPI, UART, I²C, GPIO
- Up to 1 GB DDR3
- Up to 16 GB eMMC
- Low power, low jitter, MEMS oscillator
- PWR in: AC adapter, USB, or single cell (1S) Li-Ion/Li-Po battery
- PWR out: 1.8 V, 3.3 V, and SYS
- Selectable I/O voltage: 1.8 V or 3.3 V
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- Integrates over 100 components
- Compatible with AM335x development tools and software
- Significantly reduces design time
- 45% reduction in board space vs. discrete implementation
- Decreases layout complexity
- Wide BGA ball pitch allows for low-cost assembly
- Simplifies component sourcing
- Increased reliability through a reduced number of components
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