NeoScale High-Speed Mezzanine System

Product Highlights > NeoScale High-Speed Mezzanine System

            NeoScale High-Speed Mezzanine System
                    Molex introduces NeoScale high-speed mezzanine receptacles and plugs for space-constrained designs
    

Image of Molex's NeoScale™ High-Speed Mezzanine System Ideal for space-constrained designs with a limited PCB real estate, the modular NeoScale mezzanine system from Molex provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix-and-match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs (85 ohm and 100 ohm), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

Video: NeoScale High-Speed Mezzanine System

Features
Patent-pending modular triad wafer design with four triad configurations and high-speed differential pairs (in both 85 ohm and 100 ohm impedance), high-speed single-ended traces, low-speed single-ended lines, and power contacts provides a customized system for design flexibility Housing design based on honeycomb construction isolates each differential pair for optimal performance and customization High-speed triad wafers comprise three-pins per differential pair (two signal pins and one shielded ground pin) providing stand-alone 28+ Gbps fully shielded differential pairs with dedicated grounds Connectors feature 246 circuits with a density of 82 differential pairs per square inch offers ultra-high-density signal solution with optimal signal integrity performance Mirror-image triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively providing ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing		Tombstone structures incorporated within the receptacle housing prevents terminal damage by protecting the mating contact interface Innovative PCB connection using patented Solder-Charge Technology; proven surface mount technology (SMT) attach method for highly reliable and robust solder joints Available in 12 mm to 42 mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8-, and 10-rows and 85 ohm or 100 ohm impedance provides design flexibility to address engineering constraints in system envelopes Reliable mating interface with 2 mm wipe gives sufficient conductive wipe for clean signal transmission and enhanced performance Durable housing material provides a robust system with mechanical stability
Specifications
Reference Information Packaging: tray Mates with NeoScale vertical plug (series 170807) or with NeoScale vertical receptacle (series 170814) Designed in millimeters RoHS: yes Halogen-free: yes Electrical Voltage (max): 30 V_AC(rms) max Current (max): 1 A Contact resistance: 30 mΩ max Dielectric withstanding voltage: 200 V_AC(rms) Insulation resistance: 1,000 MΩ mini		Mechanical Contact retention to housing: 1 N Mating force: 0.75 N maximum Unmating force: 0.25 N minimum Durability (minimum): 100 cycles Physical Housing: high-temperature LCP Contact: copper (Cu) Plating: contact area – 30 μ" gold (Au); solder tail area – 15 μ" gold (Au); underplating – 45 μ" nickel (Ni) Operating temperature: -55°C to 85°C