Molex Inc

NeoScale High-Speed Mezzanine System

Molex introduces NeoScale high-speed mezzanine receptacles and plugs for space-constrained designs

Image of Molex's NeoScale™ High-Speed Mezzanine SystemIdeal for space-constrained designs with a limited PCB real estate, the modular NeoScale mezzanine system from Molex provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix-and-match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs (85 ohm and 100 ohm), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

Video: NeoScale High-Speed Mezzanine System

Features
  • Patent-pending modular triad wafer design with four triad configurations and high-speed differential pairs (in both 85 ohm and 100 ohm impedance), high-speed single-ended traces, low-speed single-ended lines, and power contacts provides a customized system for design flexibility
  • Housing design based on honeycomb construction isolates each differential pair for optimal performance and customization
  • High-speed triad wafers comprise three-pins per differential pair (two signal pins and one shielded ground pin) providing stand-alone 28+ Gbps fully shielded differential pairs with dedicated grounds
  • Connectors feature 246 circuits with a density of 82 differential pairs per square inch offers ultra-high-density signal solution with optimal signal integrity performance
  • Mirror-image triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively providing ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing
  • Tombstone structures incorporated within the receptacle housing prevents terminal damage by protecting the mating contact interface
  • Innovative PCB connection using patented Solder-Charge Technology; proven surface mount technology (SMT) attach method for highly reliable and robust solder joints
  • Available in 12 mm to 42 mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8-, and 10-rows and 85 ohm or 100 ohm impedance provides design flexibility to address engineering constraints in system envelopes
  • Reliable mating interface with 2 mm wipe gives sufficient conductive wipe for clean signal transmission and enhanced performance
  • Durable housing material provides a robust system with mechanical stability
Specifications
  • Reference Information
    • Packaging: tray
    • Mates with NeoScale vertical plug (series 170807) or with NeoScale vertical receptacle (series 170814)
    • Designed in millimeters
    • RoHS: yes
    • Halogen-free: yes
  • Electrical
    • Voltage (max): 30 VAC(rms) max
    • Current (max): 1 A
    • Contact resistance: 30 mΩ max
    • Dielectric withstanding voltage: 200 VAC(rms)
    • Insulation resistance: 1,000 MΩ mini
  • Mechanical
    • Contact retention to housing: 1 N
    • Mating force: 0.75 N maximum
    • Unmating force: 0.25 N minimum
    • Durability (minimum): 100 cycles
  • Physical
    • Housing: high-temperature LCP
    • Contact: copper (Cu)
    • Plating: contact area – 30 μ" gold (Au); solder tail area – 15 μ" gold (Au); underplating – 45 μ" nickel (Ni)
    • Operating temperature: -55°C to 85°C
Published: 2016-01-08