BMI-S-608 Shield Frame

Laird's BMI-S-608 shield frame, with its coverless, stainless-steel design, features rows of integrated contact spring fingers positioned on each inner sidewall of the four-sided shield. Traditional shield covers are unnecessary when using this addition to Laird's standard board-level shield product line. The shield's structure helps mitigate EMI and functions as an integral structural part of a manufacturer's separate diecast/heat sink main housing.

BMI-S-608's spring fingers grasp the heat sink housing directly, tightly integrating the heat sink directly with the PCB's heat-sensitive components. The diecast/heat sink (lid) and spring fingers (frame) combination provides a shielding solution surrounding PCB components. BMI-S-608 enables added design flexibility by reducing the required spacing between adjacent shields, making repairs easier and lowering labor costs.

BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure seal of the diecast housing ensure it will retain direct, surface-to-surface contact with high thermal load integrated circuits.