BNO08x Series IMU

CEVA Hillcrest Labs’ BNO08x family (BNO085/BNO086) is a System in Package (SiP) that integrates a triaxial accelerometer, triaxial gyroscope, magnetometer, and a 32-bit Arm® Cortex®-M0+ microcontroller running CEVA's SH-2 firmware. The SH-2 includes MotionEngine™ software, which provides sophisticated signal processing algorithms to process sensor data and provide precise real-time 3D orientation, heading, calibrated acceleration, and calibrated angular velocity, as well as more advanced contextual outputs. The BNO08x is integrated into a single 28-pin LGA 3.8 mm x 5.2 mm x 1.1 mm package. It is compatible with Android and provides a turnkey sensor hub solution, eliminating the complexity and investment associated with a discrete design. The BNO08x features an enhanced sensor fusion algorithm which enables the use of add-on host-based software products for the AR/VR and other specialized markets. The BNO086 may be used as a drop-in replacement for the BNO085, with an identical pinout and software feature set. The BNO086 is a further enhancement over the BNO085, offering 14-bit accelerometer fusion to reduce idle state power and provide interactive calibration.

The BNO086 development kit is a demonstration and evaluation platform that allows quick and easy development and prototyping. It is designed as a shield and simply plugs into the STMicroelectronics' STM32 Nucleo-F411RE prototyping platform. All necessary source code, guides, reference manuals, datasheets, and schematics are included for a quick and straightforward installation.

DFU extensive data modes

• Linear acceleration
• Angular velocity
• Angular position (quaternion)
• Data returned at configurable sample rates
• Timestamps attached to sensor reports
• AR/VR stabilization applied to rotation vectors provides visually improved angular position output
• Low latency, 1 kHz gyro rotation vector for AR/VR applications

Applications

• Wearables such as head trackers for AR/VR applications, smartwatches, fitness bands, and audio headsets
• Smartphones
• Tablets
• Ultrabooks
• Robotics
• Internet of Things (IoT)

Development Kit Features

• The board includes the BNO086 9-axis SiP, Bosch Sensortec's BME280 pressure/temperature/humidity sensor, and Capella CM36686 proximity/ALS sensors
• The board provides test points to measure the current consumption of the BNO086
• Dimensions: 2.425" x 2.85"