HARTING

3D MID Component Carriers

HARTING's component carriers offer a customized layout for traces

Image of HARTING's 3D MID Component CarriersHARTING's 3D molded interconnect device (MID) technology replaces circuit boards by utilizing a three-dimensional circuit on molded plastic to fit the space of small applications. The 3D shape also allows a more compact integration of electrical components into the available space. Many markets have benefited from 3D MID technology. Some of the most common uses is in medical applications.

Features
  • Universal design of substrate
  • Shipped in tape-and-reel as sub-assembly for fully automated SMT processing
  • Use of high-temperature plastic for reflow soldering
  • Customized layout for traces
Applications
  • Medical
    • Hearing aids, implants, and surgical and dental instruments
  • Industrial
  • Sensors
  • Automobiles

3D MID Component Carriers

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
CARRIER_BT494030_SOT23-6_H78010300003CARRIER_BT494030_SOT23-6_H0 - ImmediateSee Page for PricingView Details
CARRIER_BT80704278010300004CARRIER_BT807042579 - Immediate$24.72View Details
CARRIER_BT494030_SOT23-3_V78010300005CARRIER_BT494030_SOT23-3_V0 - ImmediateSee Page for PricingView Details
CARRIER_BT80704278010300006CARRIER_BT8070420 - ImmediateSee Page for PricingView Details
Published: 2022-08-30