ADTF3175 Time-of-Flight (ToF) Module

Product Highlights > ADTF3175 Time-of-Flight (ToF) Module

            ADTF3175 Time-of-Flight (ToF) Module
                    Analog Devices' ADTF3175 ToF module is fully calibrated at multiple range and resolution modes
    

Image of Analog Devices' ADTF3175 Time-of-Flight Module ADI's ADTF3175 is a complete ToF module for high-resolution 3D depth sensing and vision systems. Based on the ADSD3100, a 1 Megapixel CMOS indirect ToF (iToF) imager, the ADTF3175 also integrates the lens and optical bandpass filter for the imager, an infrared illumination source containing optics, laser diode, laser diode driver and photodetector, a Flash memory, and power regulators to generate local supply voltages. The module is fully calibrated at multiple range and resolution modes. To complete the depth sensing system, the raw image data from the ADTF3175 is processed externally by the host system processor or depth ISP.

The ADTF3175 image data output interfaces electrically to the host system over a 4-lane mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) Tx interface. The module programming and operation are controlled through 4-wire SPI and I²C serial interfaces.

The ADTF3175 has module dimensions of 42 mm × 31 mm × 15.1 mm and is specified over an operating temperature range of -20°C to +65°C.

The EVAL-ADTF3175D-NXZ ToF evaluation kit showcases the ADTF3175 module with ADI's depth ISP, the ADSD3500. The kit supports Ethernet over USB connectivity to a PC for real-time visualization, capture, and post-processing of depth data. The kit includes host PC software (Windows) and an open-source multi-platform SDK for custom application development.

Features

1024 × 1024 ToF imager with 3.5 μm × 3.5 μm pixels
75° × 75° Field of View (FOV)
Imager lens subassembly with 940 nm bandpass filter
Illumination subassembly with eye safety support
4-lane MIPI CSI-2 Tx interface, 1.5 Gbps per lane
4-wire SPI and 2-wire I²C serial interfaces
Depth accuracy: ±5 mm (across full depth range)
Available in 50-lead, MODULE, ML-50-1 package

NVM (Flash) for module boot-up sequence
Power regulators for local imager and illumination rails
Calibrated modes at 1024 x 1024 and 512 x 512 resolutions
Depth range: 0.4 m to 4 m [depth noise (1 σ) 15 mm maximum, 19% minimum target reflectance, 3 klux equivalent sunlight]

Applications