ATS-2651-C2-R0 BGA Heat Sink for ADI

Product Highlights > ATS-2651-C2-R0 BGA Heat Sink for ADI

            ATS-2651-C2-R0 BGA Heat Sink for ADI
                    ATS’ high-performance fanSINK™ with a superGRIP™ heat sink attachment is designed for Analog Devices evaluation boards
    

Advanced Thermal Solutions' fanSINK is designed specifically for Analog Devices' reference designs AD9166, AD9986/8, AD9081/2, and the quad-mxFE. The fanSINK works to provide airflow directly to the communications, mixed signal, or RF devices on these evaluation boards, enabling them to operate to their design performance specification.

Features

21.00 mm x 21.00 mm x 13.50 mm BGA heat sink
Heat sink includes 7/8" screws that fit 10 mm thick fans
Product hole pattern is 20 mm center-to-center (C-C)
Component attachment: ATS superGRIP is a proven high-reliability mechanical attachment system
superGRIP hardware includes a high-performance plastic frame clip and 300 series stainless steel spring clip-avoiding PCB through holes
Provided with pre-assembled thermal interface material (TIM) centered on base
Keep-out requirements: An un-populated border zone of 3.5 mm around the component is necessary to facilitate the installation/removal of the superGRIP
Refer to superGRIP™ Clearance Guidelines and superGRIP™ Installation Guide for further details
Fan not included but available from DigiKey