Embedded Board Thermal Management Solutions

Increased edge processing, performance enhancements, and miniaturization of embedded platforms have led to an increase in power consumption and heat generation, creating thermal hotspots. Thermal stress can significantly degrade the performance of embedded systems and even cause entire system failures. Long-term exposure to excessive heat also reduces the lifespan of electronic components.

Understanding thermal management techniques is crucial for maintaining a device in optimal operating condition. Advancements in the electronics industry have driven the need for innovative thermal management technologies to enhance system reliability and performance. According to Market Research Future, the global thermal management market is expected to reach USD 20.3 billion by 2030, growing at an 8 percent CAGR between 2022 and 2030.

Thermal accessories are crucial across various electronic products, not just FPGAs, due to the heat generated during operation. Proper thermal management is essential for maintaining performance, reliability, and longevity in these devices. Here’s an inference on why thermal accessories are important for a range of products:

1. Microprocessors and CPUs:

• Heat Generation: CPUs, especially in high-performance computers and servers, generate significant heat due to intensive computational tasks.
• Thermal Accessories: Heatsinks, thermal paste, and cooling fans are critical for dissipating heat, preventing thermal throttling, and ensuring stable performance.

2. Graphics Processing Units (GPUs):

• High Power Consumption: GPUs, especially in gaming, AI, and data processing, consume a lot of power and produce a substantial amount of heat.
• Thermal Management: Cooling solutions like large heatsinks, fans, and sometimes liquid cooling are necessary to maintain optimal temperatures, prevent overheating, and sustain high performance.

3. Power Supply Units (PSUs):

• Heat Dissipation: Power supplies convert AC to DC power, which involves significant energy loss as heat.
• Cooling Solutions: Active cooling with fans and passive cooling with heatsinks are essential to maintain the efficiency and longevity of power supplies.

4. Memory Modules (RAM, DRAM):

• Operational Stability: High-speed memory modules can generate heat, which if unchecked, can lead to data corruption or system instability.
• Thermal Accessories: Heat spreaders and cooling fans are used to dissipate heat and maintain data integrity and speed.

5. Networking Equipment (Routers, Switches):

• Continuous Operation: Networking equipment often runs 24/7, leading to continuous heat generation.
• Cooling Requirements: Heatsinks, fans, and sometimes environmental cooling (like air conditioning in server rooms) are necessary to ensure consistent performance and prevent failure.

6. Embedded Systems:

• Compact Design Challenges: Embedded systems often operate in constrained environments where heat dissipation is difficult.
• Thermal Solutions: Custom heatsinks, thermal pads, and specialized enclosures with cooling are used to manage heat in these compact systems, ensuring reliability in industrial and automotive applications.

7. Mobile Devices (Smartphones, Tablets):

• Thermal Constraints: Mobile devices are compact with limited space for cooling, yet they run high-performance processors and batteries that generate heat.
• Innovative Cooling: Techniques like thermal throttling, graphite heat spreaders, and advanced materials are used to manage heat without increasing device size.

8. Batteries and Power Storage:

• Safety and Longevity: Batteries, especially in electric vehicles and high-capacity storage systems, generate heat during charging and discharging.
• Thermal Management: Cooling systems, including liquid cooling, thermal management systems, and heat-resistant materials, are vital to prevent overheating, which can lead to reduced battery life or even hazardous situations.

9. Telecommunication Equipment:

• Continuous Heat Load: Base stations, antennas, and other telecom equipment generate constant heat during operation.
• Cooling Necessities: Heatsinks, fans, and climate-controlled enclosures are essential for maintaining equipment reliability and service availability.

10. High-Performance Computing (HPC) Systems:

• Extreme Heat Output: HPC systems, used in scientific research, AI, and big data analysis, involve dense computing clusters that produce significant heat.
• Advanced Cooling: Liquid cooling, immersion cooling, and sophisticated air cooling systems are critical to manage heat and ensure uninterrupted, high-speed operation.

Thermal accessories are indispensable across a wide range of electronic products, not just FPGAs. They play a vital role in dissipating heat, preventing overheating, and ensuring devices perform reliably and efficiently. Without proper thermal management, electronic products can suffer from reduced performance, instability, and potentially catastrophic failure. The choice of thermal solutions depends on the specific requirements of the product, including its power consumption, size, and operational environment.

Common heat dissipation techniques in embedded solutions

Heat dissipation techniques are more crucial than ever, with systems becoming smaller and more powerful. Designers can use several methods to remove heat from components and PCBs, with common mechanisms including:

Heatsinks and Cooling Fans - Heatsinks are large surfaced, thermally conductive metallic parts that act as passive heat exchangers, dissipating heat to the surrounding air via conduction. Adding cooling fans to heatsinks aids in the faster and more effective removal of heat. This combination is one of the most common and effective methods for cooling embedded systems, especially in environments with limited airflow.

Figure 1: This heatsink with cooling fan helps dissipate heat from the component(s) it’s mounted on. (Image source: iWave)

Heat Pipes Integration - Heat pipes are cooling devices used in high-temperature applications. A typical heat pipe consists of a fluid that absorbs heat, vaporizes, and travels along the pipe. At the condenser end, the vapor turns back into a liquid, and the cycle repeats. Heat pipes are highly efficient and can transfer heat over long distances, making them ideal for compact and high-density electronic devices.

Heat Spreaders - Heat spreaders have a large flat surface that is usually pressed directly against another large flat surface. They allow heat transfer from a smaller component to a larger metal surface. Heat spreaders are ideal for devices that must withstand extreme shocks and vibrations or are housed inside sealed containers. They provide a robust solution for managing heat in ruggedized and sealed embedded systems.

Thermoelectric Coolers (TECs) - Thermoelectric coolers are ideal for systems where component temperature must be kept constant. High-power dissipation processors often use a combination of TECs, air cooling, and liquid cooling to extend beyond conventional air-cooling limits. TECs can cool components to temperatures below ambient, providing precise temperature control.

Thermal Vias - Thermal via arrays are incorporated over copper-filled areas and placed close to power sources. In this method, heat flows from components to the copper area and dissipates through the air from the vias. Thermal vias are often used in power management modules and components with thermal pads, enhancing the thermal conductivity of the PCB.

Liquid Cooling Systems - Liquids can transfer heat four times faster than air, enabling higher thermal performance in smaller solutions. A liquid cooling system includes a cold plate or cooled enclosure to interface with the heat source, a pump or compressor to circulate the liquid, and a heat exchanger to absorb and dissipate the heat safely. Liquid cooling is particularly effective for high-power applications and densely packed electronic assemblies.

Thermal solutions from iWave

iWave's expert team of mechanical engineers designs heatsinks, fan sinks, and enclosures tailored to the specific thermal characteristics of their products. They use thermal simulation software to help engineers determine the most appropriate cooling methods and understand the associated thermal parameters, ultimately improving overall product reliability.

Heat Flow Pattern Analysis

Using tools like Ansys Icepak, iWave engineers can simulate heat flow patterns within a device. This analysis helps identify thermal hotspots and optimize the placement of cooling components. By understanding how heat moves through a system, engineers can design more effective thermal management solutions.

Custom Heatsink Design

iWave designs custom heatsinks to fit the unique needs of each project. The design process involves calculating theoretical heat dissipation values based on surface area and material properties. Engineers then test these designs using simulation software to ensure they provide adequate cooling under various operating conditions.

Cooling Methods for Active Devices

Active cooling methods, such as the integration of TECs and cooling fans, are also considered during the design phase. iWave evaluates the benefits and limitations of each method, selecting the most efficient and cost-effective solution for each application.

Thermal Solutions for All Form Factors

iWave offers thermal solutions for all form factors, including OSM, SMARC, Qseven, and SODIMM. These solutions utilize aluminum alloy AL6063 due to its excellent material properties. Aluminum is a superb conductor, non-toxic, recyclable, and highly durable, making it ideal for transferring heat from components.

Through in-house thermal solutions, product designers can reduce implementation costs by eliminating engineering delays, field failures, and product iterations. Reducing the amount of heat dissipated by the device improves efficiency and reliability, ensuring the longevity of the product.

Conclusion

The increasing complexity and power density of embedded systems necessitate advanced thermal management techniques. By employing a variety of heat dissipation methods, from heatsinks and cooling fans to liquid cooling systems and thermal vias, designers can ensure optimal performance and reliability of their devices. Companies like iWave provide specialized thermal solutions tailored to the specific needs of their products, leveraging advanced simulation tools and custom designs to meet the challenges of modern electronics.

For more information on iWave's thermal solutions expertise, contact them directly.