Product Listing View All
- Thermal - Accessories (86)
- Thermal - Adhesives, Epoxies, Greases, Pastes (26)
- Thermal - Heat Pipes, Vapor Chambers (78)
- Thermal - Heat Sinks (1023)
- Thermal - Liquid Cooling (25)
- Thermal - Pads, Sheets (98)
- Thermal - Thermoelectric, Peltier Assemblies (4)
- Thermal - Thermoelectric, Peltier Modules (10)
Newest Products View All (25)
Wakefield-Vette’s 960 series push-pin heat sinks have plastic push-pins that engage with a hole in one application's PCB design. Learn More
Wakefield-Vette's ulTIMiFlux™ fully cured dispensable gels require no mixing or curing, providing superior design flexibility. Learn More
Wakefield-Vette’s HPLC-RM series is a refrigerant-free temperature control device mountable in a 19-inch rack. Learn More
Wakefield-Vette's ulTIMiFlux high performance dielectric phase-change material which utilizes a substrate to act as a thermally conductive carrier in order to deliver you uniform thickness coating of phase-change compound on both sides. Learn More
Recent PTMs View All (8)
This presentation will outline the ways these recirculating chillers work and how to understand their performance for a given particular application.Duration: 5 minutes
An introduction on utilizing and designing with Wakefield-Vette vapor chambers, as well as a comparison of vapor chambers to heat pipesDuration: 5 minutes
Featured Videos View All (14)
In this video Wakefield Solutions shows one of its Hundred CNC Machining Centers, Featured in this clip is a Horizontal Hass EC400. Wakefield is capable of not only extruding its own Aluminum but also machining it under one roof!
Wakefield-Vette’s 900 Series Heat Sinks for BGA Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.
Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.
Overview: Industry trends continue to produce smaller footprints with higher power densities. In some cases, Liquid Cooling is the answer for cooling your application.