MBA14001-11L/1.7Y
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA14001-11L/1.7Y

DigiKey Part Number
4573-MBA14001-11L/1.7Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA14001-11L/1.7Y
Description
AL HEAT SINK 14X14X11MM WITH LIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Fins
Length
0.551" (14.00mm)
Width
0.551" (14.00mm)
Diameter
-
Fin Height
0.354" (9.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 866
Check for Additional Incoming Stock
Quantity
All prices are in HKD
Tray
QuantityUnit PriceExt Price
1$13.83000$13.83
10$12.24100$122.41
25$11.66320$291.58
40$11.37450$454.98
112$10.76991$1,206.23
336$10.15967$3,413.65
448$10.00556$4,482.49
1,008$9.58317$9,659.84
4,928$8.80607$43,396.31
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Associated Product
1 Items
XC3S250E-4VQG100C

XC3S250E-4VQG100C

IC FPGA 66 I/O 100VQFP

AMD

$421.23000
You May Also Be Interested InSee All
3 Items
MBH15001-15L/2.5

MBH15001-15L/2.5

AL HEAT SINK 15X15X15MM

Malico Inc.

$17.04000
HSB03-141406

HSB03-141406

HEAT SINK, BGA, 14 X 14 X 6 MM

Same Sky (Formerly CUI Devices)

$6.34000
3083

3083

ALUM HEAT SINK FOR RASPBERRY PI

Adafruit Industries LLC

$12.35000