TS991SNL35T3
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TS991SNL35T3

DigiKey Part Number
315-TS991SNL35T3-ND
Manufacturer
Manufacturer Product Number
TS991SNL35T3
Description
THERMALLY STABLE SOLDER PASTE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet
 Datasheet
Product Attributes
Type
Description
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Category
Manufacturer
Chip Quik Inc.
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
-
Form
Syringe, 1.23 oz (34.869g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Weight
-
0 In Stock
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All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$350.12000$350.12
5$301.72200$1,508.61
10$282.98400$2,829.84
25$259.95360$6,498.84
50$243.74840$12,187.42
100$228.51460$22,851.46
Manufacturers Standard Package