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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TS391LT250 | |
|---|---|
DigiKey Part Number | TS391LT250-ND |
Manufacturer | |
Manufacturer Product Number | TS391LT250 |
Description | THERMALLY STABLE SOLDER PASTE NO |
Manufacturer Standard Lead Time | 3 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | - | |
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
Diameter | - | |
Melting Point | 281°F (138°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 4 | |
Process | Lead Free | |
Form | Jar, 8.8 oz (250g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | |
Shipping Info | - | |
Base Product Number |
In-Stock: 10
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Quantity
All prices are in HKD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $699.31000 | $699.31 |
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