SMDLTLFP15T4
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SMDLTLFP15T4
SMDLTLFP15T4
Chip Quik’s - Patent Pending Two-Part Mix Solder Paste

SMDLTLFP15T4

DigiKey Part Number
SMDLTLFP15T4-ND
Manufacturer
Manufacturer Product Number
SMDLTLFP15T4
Description
TWO PART MIX SOLDER PASTE
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Type
Solder Paste, Two Part Mix
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 0.53 oz (15g)
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Base Product Number
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In-Stock: 12
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All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$164.23000$164.23
Manufacturers Standard Package