Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
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Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
SMDLTLFP15T4

SMDLTLFP15T4

DigiKey Part Number
SMDLTLFP15T4-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMDLTLFP15T4
Description
TWO PART MIX SOLDER PASTE
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
4
Manufacturer
Chip Quik Inc.
Process
Lead Free
Packaging
Bulk
Form
Jar, 0.53 oz (15g)
Part Status
Active
Shelf Life
24 Months
Type
Solder Paste, Two Part Mix
Shelf Life Start
Date of Manufacture
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Melting Point
281°F (138°C)
Base Product Number
Flux Type
No-Clean
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Additional Resources
In-Stock: 11
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Quantity
All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$164.02000$164.02
Manufacturers Standard Package
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