Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 2.12 oz (60g)
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Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 2.12 oz (60g)

SMD291SNL60T4

DigiKey Part Number
SMD291SNL60T4-ND
Manufacturer
Manufacturer Product Number
SMD291SNL60T4
Description
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 2.12 oz (60g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
4
Manufacturer
Chip Quik Inc.
Process
Lead Free
Packaging
Bulk
Form
Jar, 2.12 oz (60g)
Part Status
Active
Shelf Life
24 Months
Type
Solder Paste, Two Part Mix
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Base Product Number
Flux Type
No-Clean
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
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All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$369.56000$369.56
Manufacturers Standard Package