Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
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NC191LT250T5

DigiKey Part Number
315-NC191LT250T5-ND
Manufacturer
Manufacturer Product Number
NC191LT250T5
Description
SMOOTH FLOW LOW TEMP SOLDER PAST
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
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Category
Flux Type
No-Clean
Manufacturer
Chip Quik Inc.
Mesh Type
5
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 8.8 oz (250g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Melting Point
280°F (138°C)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 3
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All prices are in HKD
Bulk
QuantityUnit PriceExt Price
1$640.87000$640.87
Manufacturers Standard Package