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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | 3M | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | SOIC | |
Number of Positions or Pins (Grid) | 14 (2 x 7) | |
Pitch - Mating | - | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | - | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | - | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES), Glass Filled | |
Operating Temperature | -55°C ~ 150°C | |
Termination Post Length | 0.140" (3.56mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating (Amps) | 1 A | |
Contact Resistance | - | |
Base Product Number |
In-Stock: 25
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Quantity
All prices are in HKD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $308.98000 | $308.98 |
| 10 | $262.60400 | $2,626.04 |
| 30 | $243.01833 | $7,290.55 |
| 50 | $234.42240 | $11,721.12 |
| 100 | $223.24400 | $22,324.40 |
| 250 | $209.28428 | $52,321.07 |
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