Thermal Management Solutions

Thermal Management Solutions

Control over the Component Heat

Thermal Management describes all the methods used to take care of all the excess heat that electronic devices and components generate. It is a field of upmost importance in order to guarantee reliability of electronic devices and components, develop robust devices and reduce e-waste.

  • Provide a path for the heat energy
  • Spreading the heat over a larger disssipation area
  • Avoiding the overheating of components
Thermal Management Solutions
 

Thermal Management Solutions Categories

Gap Fillers

Gap Fillers

Gap Fillers remove the air between a component and a cooling assembly, from small to large gaps.

Heat Spreaders

Heat Spreaders

Heat Spreaders distribute heat energy in a horizontal axis. This enables the use of large surfaces for heat dissipations as well as use cooling assemblies larger than the surface of the hot component for enhanced cooling.

 
 
 

Thermal Management Portfolio

Depending on the requirements of the application, we have a solution for you: whether the need to fill a small or large gap, one that enables the mounting of a cooling assembly without the need of additional mechanical fixing or the need of a heat spreading product.

WE-TGF: Thermal Gap Filler Pad

WE-TGF: Thermal Gap Filler Pad

The WE-TGF is a silicone elastomer gap filler pad, designed to fill a gap between one or multiple electronic components and a cooling assembly, such as heating a cooling plate or metal housing. The gap filler pads are available with thermal conductivity from 1 to 10 W/mK with thicknesses from 0.5 to 18 mm.

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WE-TINS: Thermally Conductive Insulator Pad

WE-TINS: Thermally Conductive Insulator Pad

WE-TINS is a thin silicone pad designed to electrically insulate electronic components and cooling assemblies while allowing the flow of heat. The insulator pads are available with thermal conductivity from 1.6 W/mK to 3.5 W/mK and have a thickness of 0.23 mm.

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WE-PCM: Thermal Phase Changing Material

WE-PCM: Thermal Phase Changing Material

The WE-PCM is a phase changing material which are known for remaining solid at room temperature and changing into a flowing state with increasing temperature to ensure the best thermal interface. The phase changing materials have a thermal conductivity from 1.6 to 5 W/mK and a thickness of 0.2 mm.

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WE-TTT: Thermal Transfer Tape

WE-TTT: Thermal Transfer Tape

The WE-TTT is a double-sided tape designed to provide a thermal interface which at the same time allows mechanical fixing in both contact surfaces without the need of additional screws or clips. The thermal transfer tape is available with a thermal conductivity of 1 W/mK and have a thickness of 0.2 mm.

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WE-TGFG: Graphite Foam Gasket

WE-TGFG: Graphite Foam Gasket

The WE-TGFG is a synthetic graphite layer wrapped around a core of foam. This enables the use of a highly conductive heat spreader to fill vertical caps and provide a silicone-free alternative to the WE-TGF. The foam gaskets are available with a thermal conductivity of 400 W/mK and have a thickness of 1.5 to 25 mm.

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WE-TGS: Graphite Sheet

WE-TGS: Graphite Sheet

The WE-TGS is a synthetic graphite heat spreader. This implies that most of the thermal conductivity provided by material occurs at the horizontal or XY axis. The graphite sheet is available with a thermal conductivity of 1800 W/mK and has a thickness of 0.03 mm.

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