HSF Series Heat Sink/Fan Combinations

Wakefield Thermal's HSF series heat sink/fan combinations can be matched up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more. These heat sinks are designed for airflow applications in the telecom, data center, networking, cloud computing, and many more industries.

The HSF series is ideal when combined with a mounted fan to achieve optimal forced convection in a small footprint. Forced convection is a mechanism in which fluid motion is generated by an external source, such as a pump, fan, or other device. While the term forced convection can be used to refer to any fluid, it is most commonly associated with forced air cooling. Because of the usually high airspeed associated with forced convection, significant amounts of heat can be transported quickly and efficiently. The amount of surface area on the heat sink is an important factor in helping meet the desired thermal performance, but too much surface area will cause the heat sink to have a large pressure drop. The greater the drop-in pressure, the greater the strain put on the fan, which results in decreased fan performance. Wakefield Thermal engineers can help find the optimal operation point to achieve thermal requirements.