901-910 Series Clip-Chip Heat Sinks

Wakefield Thermal’s 901-910 heat sink series supports the thermal cooling needs for chipsets manufactured by Intel, Broadcom, Motorola, TI, and more. A range of chip footprints from 19 mm to 40 mm has been developed. The product is a six-piece unit including the heat sink, clip, and four-springs mounting device which are combined into one unit and allows for easy assembly onto the chip-set by using the space that is between the PCB and the substrate of the solder balls.

The heat sinks are offered in either pin-fin or elliptical-fin configurations and are designed for air flow applications. The pin-fin configuration is ideal for bi-directional air-flow and natural convection applications. The elliptical-fin configuration improves air flow for multiple heat sinks in the same air stream.

Features

• The heat sinks are made from AL 6063 aluminum
• Finish: black anodized
• Heat sink sizes are matched to chip footprints
• Easy "snap-on" assembly
• Thermal interface material can be pre-applied
• This product is ideal for shock and vibration applications