ENGINEERED CONNECTIVITY FOR 5G COMMUNICATIONS

Solutions for a Board Range of Configurations

High Speed Backplane

STRADA Whisper Connectors

Transfer data at speeds of 56 Gbps with a roadmap to 112 Gbps—upgrade without costly backplane redesigns.

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IMPACT Connectors

This system is available in two designs providing flexibility to optimize for advanced mechanical and electrical performance.

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Z-PACK Slim UHD High-Speed Connectors

Designed to be among the densest connectors with the smallest possible footprint to free up valuable PCB space.

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Z-PACK HM-Zd Plus Connectors

Reduce noise and system crosstalk with this double-ground design.

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Internal Interconnect

M.2 NGFF

Save more than 20% of PCB real estate compared to the PCI Express Mini Card.

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Free Height Connectors

These versatile connectors are useful for downsizing applications that require parallel stacked circuit boards.

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Fine Pitch Board-to-Board (BTB)

0.4 mm pitch plus new shielded board-to-FPC solution.

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Mini CT Connectors

Miniature wire-to-board connectors that feature a compact pitch design.

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Silver Interconnects

Flexible, robust & provides optimal signal integrity, while also saving space and lowering design costs.

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Input/Output (I/O)

OSFP

OSFP integrates thermal management directly into the form factor, eliminating the high thermal resistance between the module and the heat sink.

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QSFP-DD

QSFP-DD doubles the density of QSFP and eight differential pairs capable of 50 Gbps each to achieve 400 GbE.

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SFP/SFP+/zSFP+

SFP interconnects support data rates up to 56 Gbps. Many cage configurations offered provide excellent shielding options.

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QSFP/QSFP+/zQSFP+

The quad small form factor pluggable (QSFP) portfolio of interconnects offers a large range of simple and customizable design options up to 56 Gbps.

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Mini-SAS HD Connectors

Designed to provide next generation speeds for both internal and external applications.

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Power

MULTI-BEAM XLE Connectors

This hot pluggable series is a space saver with slim guide sockets and vented housing for better heat dissipation.

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ELCON Mini Power Connectors

Low profile solutions with up to 40 A per contact and positive latch retention for cable-to-PCB applications.

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Memory & Sockets

SATA

Alignment-free and slant insertion styles provide solutions for PCB space saving.

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DDR4 DIMM Connectors

Space savings, reduced height, improved power consumption, and higher data rates than the DDR3.

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Land grid array (LGA) Sockets

Socket technology for microprocessor packages up to 10,000+ positions.

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Copper Cable Assemblies

QSFP28 Copper Cables

With 8 differential pairs, these assemblies provide 4 channels at speeds up to 28 Gbps each.

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QSFP+ 33 AWG Cables

Fine wire cable that’s ultra-thin, light weight & highly flexible for high density intra-rack applications.

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Bandwidth for the Next Generation

TE Connectivity’s (TE) global experience in a wide range of connectivity applications helps our customers “design in” efficiency and agility into data center infrastructure and data center equipment. We have a full set of interconnect and cabling solutions to increase bandwidth, density and reliability for all types of telecommunications and enterprise routing and switching equipment. We offer products for applications at 10, 25, 40, 100 and up to 400 Gbps to support converged internet protocol (IP) networks. Count on us to provide solutions to support your enterprise’s current and future demand for data, speed, and power efficiency

High Speed Backplane

STRADA Whisper Connectors

Transfer data at speeds of 56 Gbps with a roadmap to 112 Gbps—upgrade without costly backplane redesigns.

View Details

IMPACT Connectors

This system is available in two designs providing flexibility to optimize for advanced mechanical and electrical performance.

View Details

Z-PACK Slim UHD High-Speed Connectors

Designed to be among the densest connectors with the smallest possible footprint to free up valuable PCB space.

View Details

Z-PACK HM-Zd Plus Connectors

Reduce noise and system crosstalk with this double-ground design.

View Details

Internal Interconnect

Free Height Connectors

These versatile connectors are useful for downsizing applications that require parallel stacked circuit boards.

View Details

Fine Pitch Board-to-Board (BTB)

0.4 mm pitch plus new shielded board-to-FPC solution.

View Details

Mini CT Connectors

Miniature wire-to-board connectors that feature a compact pitch design.

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DDR4 DIMM Connectors

Space savings, reduced height, improved power consumption, and higher data rates than the DDR3.

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Silver Interconnects

Flexible, robust & provides optimal signal integrity, while also saving space and lowering design costs.

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Input/Output (I/O)

OSFP

OSFP integrates thermal management directly into the form factor, eliminating the high thermal resistance between the module and the heat sink.

View Details

QSFP-DD

QSFP-DD doubles the density of QSFP and eight differential pairs capable of 50 Gbps each to achieve 400 GbE.

View Details

SFP/SFP+/zSFP+

SFP interconnects support data rates up to 56 Gbps. Many cage configurations offered provide excellent shielding options.

View Details

QSFP/QSFP+/zQSFP+

The quad small form factor pluggable (QSFP) portfolio of interconnects offers a large range of simple and customizable design options up to 56 Gbps.

View Details

Mini-SAS HD Connectors

Designed to provide next generation speeds for both internal and external applications.

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Power

MULTI-BEAM XLE Connectors

This hot pluggable series is a space saver with slim guide sockets and vented housing for better heat dissipation.

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CROWN CLIP Connectors

Offers a low insertion/extraction force for high-current mating directly to a power bus bar.

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ELCON Mini Power Connectors

Low profile solutions with up to 40 A per contact and positive latch retention for cable-to-PCB applications.

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Ethernet

RJ45 Connectors

Extensive portfolio with many configurations and solutions up to a Cat6 performance rating.

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RJ point five Connectors

This next-gen Ethernet link offers higher density solutions for a competitive total cost of ownership per port.

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Copper Cable Assemblies

Copper Cables

Our copper cable assemblies are engineered for 56 Gbps and beyond. Custom cabling solutions are also offered.

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Storage Solutions that Grow with Your Demand

As the Internet of Things (IoT) expands and the growing connected world generates exponentially more data, efficient and reliable storage solutions become even more critical within the data center. Whether you are designing to scale up or scale out with your data center storage solutions, TE has a broad range of input/output (I/O), board-to-board, power products and more to help you achieve your storage performance objectives. We combine innovation and quality, dependable products with the flexibility to deliver storage interconnect solutions practically anywhere in the world. We are your partner for creating the solutions that meet the demand of the next generation of our data-driven world.

High Speed Backplane

STRADA Whisper Connectors

Transfer data at speeds of 56 Gbps with a roadmap to 112 Gbps—upgrade without costly backplane redesigns.

View Details

IMPACT Connectors

This system is available in two designs providing flexibility to optimize for advanced mechanical and electrical performance.

View Details

Z-PACK Slim UHD High-Speed Connectors

Designed to be among the densest connectors with the smallest possible footprint to free up valuable PCB space.

View Details

Z-PACK HM-Zd Plus Connectors

Reduce noise and system crosstalk with this double-ground design.

View Details

Internal Interconnect

M.2 NGFF

Save more than 20% of PCB real estate compared to the PCI Express Mini Card.

View Details

Free Height Connectors

These versatile connectors are useful for downsizing applications that require parallel stacked circuit boards.

View Details

Silver Interconnects

Flexible, robust & provides optimal signal integrity, while also saving space and lowering design costs.

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STRADA Mesa Connectors

These mezzanine connectors have a pin and socket signal design and offer integrated power contacts.

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Input/Output (I/O)

OSFP

OSFP integrates thermal management directly into the form factor, eliminating the high thermal resistance between the module and the heat sink.

View Details

QSFP-DD

QSFP-DD doubles the density of QSFP and eight differential pairs capable of 50 Gbps each to achieve 400 GbE.

View Details

SFP/SFP+/zSFP+

SFP interconnects support data rates up to 56 Gbps. Many cage configurations offered provide excellent shielding options.

View Details

QSFP/QSFP+/zQSFP+

The quad small form factor pluggable (QSFP) portfolio of interconnects offers a large range of simple and customizable design options up to 56 Gbps.

View Details

Mini-SAS HD Connectors

Designed to provide next generation speeds for both internal and external applications.

View Details

Power

MULTI-BEAM XLE Connectors

This hot pluggable series is a space saver with slim guide sockets and vented housing for better heat dissipation.

View Details

ELCON Mini Power Connectors

Low profile solutions with up to 40 A per contact and positive latch retention for cable-to-PCB applications.

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RAPID LOCK Connectors

No install tools required for this fast, reliable replacement for power lugs.

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Memory & Sockets

SATA

Alignment-free and slant insertion styles provide solutions for PCB space saving.

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DDR4 DIMM Connectors

Space savings, reduced height, improved power consumption, and higher data rates than the DDR3.

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Land grid array (LGA) Sockets

Socket technology for microprocessor packages up to 10,000+ positions.

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SAS Connectors

These mainstream storage solutions are designed to support differential signaling at speeds of up to 12 Gbps.

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Mini PCI Express and mSATA

Right angle, surface mount expansion card sockets for express mini cards or display mini cards.

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Copper Cable Assemblies

Copper Cables

Our copper cable assemblies are engineered for 56 Gbps and beyond. Custom cabling solutions are also offered.

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ZQSFP+ Connectors

TE’s zQSFP+ connector has been designed for applications in the telecommunications, data center and networking markets that require a high-speed, high-density connector. The interconnect offers four channels of high-speed differential signals with data rates ranging from 25 Gbps up to potentially 40 Gbps, and will support 100 Gbps (4x25 Gbps) Ethernet and 100 Gbps 4X InfiniBand Enhanced Data Rate (EDR) requirements.

Key Features & Benefits

• Increased Data Rates
  • Data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4
  • Supports Ethernet and InfiniBand (IB) Enhanced Data Rate (EDR) requirements
  • Supports single channel, dual channel and quad channel implementations
• Industry Standard and Customizable Design
  • Industry standard interface
• Backwards compatible with QSFP+ cables and transceivers
• Improved loss budget for optics and copper cables at 10 Gbps
• Comprehensive Portfolio and Inventory
• Features behind and through bezel cages with various lightpipe and heat sink options
• Well-stocked distribution channel
• Improved EMI Performance
  • Increased data rates make EMI protection more challenging
  • Provide excellent EMI protection through 56 Gbps

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Connectors enable efficient use of PCB space and deliver +15 Gbps high speed performance.

With spatial requirements continuing to become more critical in designs for telecommunications, computer, military, rail systems, and more, TE offer the STRADA Mesa mezzanine connector to provide a stacking, board-to-board connection solution for efficient PCB space utilization. The STRADA Mesa product design delivers a high-speed performance of +15 Gbps. In addition, the design provides three pin and socket signal contact arrangement options -- high-speed differential, high-density single-ended and RF/ Coaxial -- to suit various application requirements.

Key Features & Benefits

• Data rates up to 15+ Gbps
• 100 Ohm impedance
• Single ended, differential, and power configurations
• Optional power contacts spaced for 48V applications per UL 1950
• 14 amp Current rating
• Optional guide system to accommodate blind mating
• Stack heights from 8-42mm in 1mm increments
• Press-Fit (Eye-of-the-Needle) PCB attach.
• Open space to allow for Airflow through connector
• Three housing sizes (widths): Standard: 40, 80, and 120 pairs; Half: 24, 48, and 88 pairs; Power: 6 -12 contacts

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Ease of Soldering and Positioning

TE LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, chips’ pin count are increasing. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. TE flexible tooling provides high-quality, fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.

Key Features & Benefits

• Socket housing facilitates efficient soldering to the PCB.
  
• Socket is supplied with a cap to facilitate vacuum pick and place.
  
• Backplates are available in zinc or nickel plating.

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Flexibility

TE broad portfolio of antenna technologies includes standard antennas and custom antennas, with two shot molding, stamped metal, flexible printed circuit (FPC), printed circuit board (PCB) and laser direct structuring (LDS) solutions. Available as embedded or multi-element external antennas, these solutions provide high-clarity transmissions in wireless devices in a wide variety of frequencies including, but not limited to: Bluetooth, Wi-Fi, LTE and ZigBee. TE operate design and manufacturing facilities worldwide, with testing capabilities in near and far field patterns, scattering parameters, SAR, vibration, humidity, temperature shock, salt fog, throughput and acoustic.

Key Features & Benefits

• High performance and innovative products
  • High reliability: high performance and isolation
  • High efficiency: optimized throughput, minimal losses
• In-house testing and validation
• State-of-the art antenna laboratories and personnel, deployed globally
• Innovation leader with leading patent portfolio
• Quick-turn designs and prototypes
• World class manufacturing capabilities
• Thrive on opportunities to solve problems together with our customers
• Community leader listed on Dow Jones Sustainability Index and named one of World’s Most Ethical Companies by Ethisphere® Institute

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Mini Connector with Optimal Power

Pack more power into smaller spaces with TE ELCON Mini power interconnects that feature a small, 8 mm height form-factor and support higher current than similar sized solutions (up to 40 Amps per contact, 400 Volts AC or DC). These interconnects provide confidence in system performance with their low resistance, highly reliable interface. Features include positive metal latch retention, optional coding contacts for sense/detect functionality, enhanced grounding, and use of industry-proven crimp contacts.

Key Features & Benefits

• Support high current up to 40 A per contact and a 400 V rating with a cost-effective stamped contact design
• Small, 8 mm height form-factor that is roughly the size of a space-saving HDMI connector
• Offered in 2-, 3-, 4- and 6- (2x3 position configurations - broader, more versatile portfolio than the competition
• Connector available in both vertical and right-angle mounts as well as press fit and through hole
• Low resistance, highly reliable interface
• Positive metal latch retention
• Cable assemblies ordered in standard or high-flex designs for easier routability, and are highly customizable
• Support 14-10 AWG cable sizes (2.5 mm² to 6 mm²)

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