NSP-35 One-Part Liquid Thermal Gap Filler

NSP-35 is a one-part, fully-cured, non-silicone gap filler from T-Global. It can be easily dispensed using standard industrial dispensing equipment and can be used to fill gaps over a wide range of tolerances.

Its unique formulation makes it highly conformable, form stable in application and produces virtually no compressive forces on solder joints or delicate components. It has a thermal conductivity of 3.5 W/mk.

• One-part, fully-cured materials offer significant lower total cost of ownership than two-part systems
• Materials do not need curing
• Increased floor space utilization
• Reduced energy costs
• Reduced process time
• Reduced dispensing equipment costs
• Ease of handling
• Reduced stock and inventory
• Reduced complexity
• Ease of rework

• Automotive
• Telecom
• Consumer electronics
• LED
• Solutions which require large area and volume and automated dispensing