SA Series Board Level Heat Sinks

Sunon’s SA series aluminum AL6063-T5 heat sinks lower thermal resistance values and pressure drop. The pin fin structure heat sinks with adhesive attachment, offer an omnidirectional design engineered to maximize air intake, while the hot air dissipates from the pin array simultaneously in every possible direction.

The SA series pin fin heat sinks are versatile for IC packages such as BGA, LGA, CPU, ASIC, etc. The straight fin structure heat sinks with nylon-A60 (V0) push pins can be mounted quickly and securely into 2.9 mm holes in the PCB for effective cooling. The pin fin heat sinks have a protective black anodize finish while the straight fin heat sinks with push pins have a degrease sliver finish. All SA series heat sinks are RoHS compliant.

Thermal Modules