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AcceleRate® Board-To-Board and Cable Systems

AcceleRate® Board-To-Board and Cable Systems

0.635 mm (0.025”) pitch solutions rated for 64 Gbps PAM4 and 112 Gbps PAM4 applications

Samtec’s AcceleRate® series provide extreme performance for both board-to-board and cable-to-board applications. The AcceleRate® HD ADF6/ADM6 series are ultra-dense, multi-row mezzanine strips rated for 64 Gbps PAM4 on a 0.635 mm (0.025”) pitch. The AcceleRate® HP APF6/APM6 series are high-performance, open-pin-field arrays rated for 112 Gbps PAM4 on a 0.635 mm (0.025”) pitch. The AcceleRate® cable-to-board ARC6/ARF6 series are the industry’s slimmest cable system with direct attach technology and ultra-low skew twinax cable rated for 64 Gbps PAM4 on a 0.635 mm (0.025”) pitch.

Additional Videos: Samtec Connections Accelerate Product Line

Features

  • 0.635 mm (0.025”) pitch
  • Speeds from 64 Gbps PAM4 to 112 Gbps PAM4
  • Edge Rate® contacts for rugged signal integrity performance
  • PCIe® 6.0/CXL® 3.2 capable
  • Open-pin-field design for grounding and routing flexibility
  • Ultra-low skew twinax cable

Industries

  • Datacom
  • Industrial
  • Military/Aerospace
  • Medical
  • Computer & Semiconductor
  • Automotive
  • Instrumentation

Literature

AcceleRate® HD Ultra-Dense Slim Arrays eBrochure

AcceleRate® Slim Body Cable Assemblies eBrochure

High-Speed Board-To-Board Guide

High-Speed Cable Guide

5G Applications Solution Guide

Military & Aerospace Solutions

Artificial Intelligence Guide

Test Connectivity Guide

Featured Products

ADF6/ADM6

AcceleRate® HD Ultra-Dense Multi-Row Arrays

  • 0.635 mm (.025”) pitch
  • Performance up to 64 Gbps PAM4 (32 Gbps NRZ)
  • Incredibly dense with up to 400 total I/Os
  • Slim 5 mm width
  • Stack Heights: 5, 7, 9, 10, 11, 12, 14 and 16 mm
  • 4-row design, 10 to 100 positions per row (40 to 400 total positions)
  • Edge Rate contact system is optimized for signal integrity performance
  • Open-pin-field design for grounding and routing flexibility
  • PCIe® 6.0/CXL® 3.2 capable

APF6/APM6

AcceleRate® HP High-Performance Arrays

  • 0.635 mm (.025”) pitch
  • Performance up to 112 Gbps PAM4 (56 Gbps NRZ)
  • Cost-optimized solution
  • Low profile 5 mm and up to 10 mm stack heights
  • Up to 800 total pins available; roadmap to 1,000+ pins
  • Open-pin-field design for grounding and routing flexibility
  • PCIe® Gen 6.0/CXL® 3.2 capable

ARC6/ARF6

AcceleRate® Slim Body Direct Attach Cable Assemblies

  • 0.635 mm (.025”) pitch
  • Performance up to 64 Gbps PAM4 (32 Gbps NRZ)
  • Incredibly slim 7.6 mm width
  • High-density 2-row design
  • 8, 16 and 24 differential pair options available
  • 34 AWG, 100 Ω Eye Speed® ultra-low skew twinax cable
  • Mating board level socket (ARF6) features standard weld tabs
  • Rugged metal latching and shielding
  • “Reversed Polarity” pinout option for reduced Far-End Crosstalk
  • Flyover system simplifying board layout and extending signal reach
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