THERMFLOW® T725 Phase Change Material

Parker Chomerics' THERMFLOW T725 is a phase change material that is ideal for vertical applications and designed to completely fill interfacial air gaps and voids within electronics assemblies. It is classified as a traditional phase change material (PCM).

The ability to completely fill air gaps and voids typical of component packages and heatsinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.

At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heatsink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure, it will readily conform to both mating surfaces. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) less than 0.001 inch or 0.0254 mm, and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

Features and Benefits

• Low thermal impedance
• Can be preapplied to heat-sinks
• Demonstrated reliability through thermal cycling and accelerated age testing
• RoHS compliant
• Protective release liners prevent contamination
• Available in custom die-cut shapes and kiss-cut on rolls

Applications

• Microprocessors
• Graphics processors
• Chipsets
• Memory modules
• Power modules

Attributes

• Excellent thermal performance
• Inherently tacky
• No adhesive required
• Ideal for vertical applications
• UL 94 V-0 flammability rated
• Tabs available for easy removal
• Sticky nature limits flowing in vertical applications