THERM-A-GAP™ T50 Dispensable Thermal Interface Material

Parker Chomerics' THERM-A-GAP TC50 is a high-performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heatsink or enclosure. The TC50 compound provides low thermal impedance at multiple gaps to allow the use of common heat spreaders. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

This one component material is formulated to accommodate today’s high-performance electronics and is ideal for automated dispensing machines, rework, and field repair situations.