THERM-A-GAP™ PAD 80LO Thermally Conductive Gap Filler Pads

The Parker Chomerics THERM-A-GAP PAD 80LO is engineered to meet the thermal management challenges of modern electronics. With its high thermal conductivity and conformable nature, it ensures efficient heat dissipation in compact and high-performance devices.

The pad's low compression force and adaptability to uneven surfaces make it ideal for applications where traditional thermal interface materials might fall short. Its electrical isolation properties further enhance safety and reliability, making it suitable for high-density electronic assemblies. Additionally, the low oil bleed characteristic ensures that the pad maintains its integrity and performance over time, reducing the risk of contamination in sensitive environments.

Available in various thicknesses and carrier options, including aluminum foil with or without pressure-sensitive adhesive (PSA), THERM-A-GAP PAD 80LO can be customized to fit specific design requirements. Its compliance with industry standards, such as NASA outgassing requirements and UL 94 V-0 flammability rating, further underscores its suitability for demanding applications. Whether designing for 5G infrastructure, automotive electronics, or advanced computing systems, PAD 80LO offers a reliable solution to maintain optimal operating temperatures.