THERM-A-GAP GEL 60HF

Parker Chomerics’ 6.2 W/m-K thermally conductive gel is designed for dispensing and ease of rework

Image of Parker Chomerics THERM-A-GAP GEL 60HFTHERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one-component, silicone-based dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high-performance heat transfer from electronic components to cooling features and is meant to be used across industries and applications.

The “HF” in GEL 60HF stands for “high flow”, indicating that the material is ideal for high-volume dispensing applications and high throughput production operations. As with all Parker Chomerics thermal gels, it is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations.

Features
  • Thermal conductivity: 6.2 W/m-K
  • High flow rate: 80 g/min
  • No secondary curing required
  • Low thermal impedance
  • Very low compression force
  • Reworkable
  • Single component
  • Room temperature storage
Applications
  • Consumer electronics
  • Telecommunications equipment
  • Energy storage devices
  • Power electronics and modules
  • Automotive control units and sensors
  • Computing components (CPUs, GPUs, and memory)

THERM-A-GAP GEL 60HF

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
THERM-A-GAP GEL 60HF 6.2 W/M-K D65-00-GEL60HF-0010THERM-A-GAP GEL 60HF 6.2 W/M-K D0 - Immediate$335.06View Details
THERM-A-GAP GEL 60HF 6.2 W/M-K D65-02-GEL60HF-0030THERM-A-GAP GEL 60HF 6.2 W/M-K D0 - Immediate$448.10View Details
THERM-A-GAP GEL 60HF 6.2 W/M-K D65-02-GEL60HF-0180THERM-A-GAP GEL 60HF 6.2 W/M-K D0 - Immediate$1,674.40View Details
THERM-A-GAP GEL 60HF 6.2 W/M-K D65-00-GEL60HF-0300THERM-A-GAP GEL 60HF 6.2 W/M-K D0 - Immediate$2,837.43View Details
Published: 2024-02-26