Parker Chomerics

THERM-A-GAP GEL 50TBL Thermally Conductive Gel

Parker Chomerics' 5.0 W/m-K high reliability, fully cured, dispensable thermal gel is designed for easy application and possible rework

Image of Parker Chomerics' THERM-A-GAP GEL 50TBL Thermally Conductive GelParker Chomerics‘ THERM-A-GAP GEL 50TBL is a reworkable, high-performance, one-component, dispensable, thermal interface material with 5.0 W/m-K bulk typical thermal conductivity. GEL 50TBL was developed to conduct heat away from electronics to a heat sink or enclosure at very thin bond lines. At minimum bond line thickness of 0.002” or 0.05 mm, the apparent thermal conductivity exceeds 11 W/m-K. The “TBL” suffix indicates this material is meant for thin bond line applications. THERM-A-GAP GEL 50TBL requires no mixing or secondary curing and is designed for easy application and possible rework.

Features
  • Very thin bond line 0.002” (0.05 mm) typical
  • Bulk thermal conductivity: 5.0 W/m-K
  • Apparent thermal conductivity at minimum bond line thickness: >11 W/m-K
  • Low thermal impedance
  • Very low compression force
  • Reworkable
  • Easily dispensed
  • No secondary curing required
  • No pump out
Applications
  • Automotive electronic control units (ECUs)
  • Telecommunications base stations
  • Power electronics and semiconductors
  • Memory and power modules
  • LEDs and consumer electronics
  • Microprocessors and graphics processors

THERM-A-GAP GEL 50TBL Thermally Conductive Gel

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
THERM-A-GAP GEL50TBL 5.0W/MK10CC65-00-GEL50TBL-0010THERM-A-GAP GEL50TBL 5.0W/MK10CC40 - Immediate$363.85View Details
THERM-A-GAP GEL50TBL 5.0W/MK30CC65-02-GEL50TBL-0030THERM-A-GAP GEL50TBL 5.0W/MK30CC0 - Immediate$445.76View Details
Published: 2024-06-24