THERM-A-GAP™ Gel 30 High-Performance, Fully Cured Dispensable Gel
Parker Chomerics' THERM-A-GAP gel 30, a 3.5 W-m/K, fully cured dispensable thermal interface gel offers proven reliability and superior design flexibility
Parker Chomerics' THERM-A-GAP™ Gel 30 is a fully cured dispensable gel designed to eliminate time-consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.
Product Attributes
- Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
- Proven reliability in extreme temperature cycling and shock and vibration
- Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures
- Accommodates a variety of bond line thicknesses for application to multiple devices
- Successfully used to fill a variety of different gap thickness
- Compatible with high volume, automated dispense processes
- Meets Telcordia (Bellcore) silicone specifications
- Easily dispensable
- Fully-cured / no pump out
- High bulk thermal conductivity
- Low thermal impedance
- Ultra-low compression force
- High tack surface and reworkable
- Proven long-term reliability
- Automotive electronic control units (ECUs)
- Power supplies and semiconductors
- Memory and power modules
- Microprocessors / graphics
- Processors
- Flat panel displays and consumer electronics