OSDZU3-REF Development Platform for the OSDZU3 System In Package (SiP)

The Octavo OSDZU3-REF is a powerful development and evaluation platform for the OSDZU3 SiP. Based on the OSDZU3 SiP using the XCZU3EG-1 Zynq UltraScale+. The OSDZU3-REF is a four-layer design that features an extensive set of peripherals, including USB 3.0, SATA, DisplayPort™, Gigabit Ethernet, and LVDS touch panel support. There are several storage options, including eMMC and SD card (primary boot). It also features a host of expansion headers, including an FMC LPC, several PS and PL PMOD, and 100 mil headers, allowing users to customize and prototype.

The OSDZU3 SiP is the fastest and most flexible way to develop a system around the AMD Zynq UltraScale+ MPSoC. It enables users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSDZU3 SiP simplifies designs utilizing the AMD ZU3 Zynq UltraScale+ MPSoC by integrating a power management solution, LPDDR4 memory, QSPI memory, and other required components into a single BGA package that is ~60% smaller than an implementation with discrete chip-down components. The integrated power management solution has been customized for the MPSoC and tailored to suit a large range of performance requirements. This integration significantly reduces the engineering time and effort spent on developing applications with the ZU3 MPSoC, accelerating the time to market by ~9 months and saving significant design costs.

The OSDZU3-REF comes preinstalled with a PetaLinux image that features various demos, allowing users to create functional designs in minutes. The OSDZU3-REF has everything you need to evaluate and begin development with the OSDZU3.