OSD32MP15x System-in-Package (SiP)

Product Highlights > OSD32MP15x System-in-Package (SiP)

            OSD32MP15x System-in-Package (SiP)
                    Octavo's OSD32MP15 is a SiP featuring STMicroelectronics' STM32MP15
    

Octavo's OSD32MP15x SiP devices deliver the power of a microprocessor in a package that feels like a microcontroller in the smallest possible footprint. At their core, the OSD32MP15x devices have the versatile STMicroelectronics STM32MP15x featuring dual Arm® Cortex®-A7 cores and an Arm Cortex-M4. Along with the processor, the OSD32MP15x family integrates up to 1 GB of DDR3, STPMIC1 power management IC, EEPROM, MEMs oscillators, and passive components into a single easy-to-use BGA package.

This integration enables the fastest designs with the STM32MP15x by removing the tedious tasks that do not add value to an end system.

Features

ST STM32MP15x, DDR3, STPMIC1, 4 KB EEPROM, oscillators, and passive components integrated into a single package
Access to all signals of the STM32MP1 TFBGA 361 package
Up to 1 GB DDR3
Low power MEMS oscillator x2
Single voltage input: 2.8 V to 5.5 V
Integrated boost: 5.2 V
System power: buck, LDOx4, power switch x2

Benefits

Integrates over 100 components
Compatible with STM32MP1 development tools and software
Significantly reduces design time
Up to 64% reduction in board space vs. discrete implementation
Decreases layout complexity
Wide BGA ball pitch allows for low-cost assembly
Simplifies component sourcing
Increased reliability through a reduced number of components