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NP560 Solder Paste
Kester’s NP560 has redefined the voiding standard for PCB assembly and the potential for low voiding performance
Kester’s NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 AR to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air with minimal graping behavior. In addition to its stable consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
Features
- Classified as ROL0 per J-STD-004B
- Halogen-free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solderability on various PCB surface finish
Applications
- Lead-free no clean SMT soldering processes
- Voiding requirements <10%
NP560 Solder Paste
| Image | Manufacturer Part Number | Description | Available Quantity | Price | View Details | |
|---|---|---|---|---|---|---|
 |  | 70-4825-0904 | NP560 SN96.5AG3.0CU0.5 T4 100 GM | 51 - Immediate | $877.45 | View Details |
|  | 70-4823-0911 | NP560 SN96.5AG3.0CU0.5 T4 600 G | 2 - Immediate | $1,719.42 | View Details |
Published: 2019-10-07
Hong Kong, China