Block Diagram

AIROC™ CYW5557x Wi-Fi 6E Tri-band and Bluetooth® 5 SoCs

Infineon Technologies' AIROC™ CYW5557x is a highly integrated Wi-Fi 6 / 6E and Bluetooth® 5.3 SoC family for seamless IoT connectivity delivering high performance while conserving more power. Supporting Wi-Fi 6 / 6E features with Tri-band (2.4 GHz, 5 GHz, 6 GHz) capability, the CYW5557x is available in both 1x1 single-input, single-output (SISO) and 2x2 multiple-input, multiple-output (MIMO) configurations. The SoC brings exceptional high-quality video/audio streaming and a seamless gaming experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.

This chip provides the technical benefits of Wi-Fi 6 – including increased communications range and robustness as well as increased battery life. It is also the first IoT Wi-Fi chip with Wi-Fi 6E support, allowing leading products access to the uncongested 6 GHz spectrum.

CYW55572 Block Diagram
Key benefits:
  • Extreme low latency from greenfield 6 GHz bands and virtual simultaneous dual band feature for seamless audio and video streaming
  • Range boost to ensure devices stay connected to remote access point
  • Enhanced network robustness features to ensure the best streaming of video/audio in congested or overlapping network environments
  • Advanced power saving features to maximize battery life
  • Network offload to offload host processing power and save system power consumption
  • Multi-layer security for protection of individual subsystems through whole product life-cycle
  • Best-in-class Bluetooth® receive sensitivity and multiple optimized transmission options of 0 dbm, 13dbm, and 20dbm of output power for various applications
  • AIROC™ Bluetooth® Stack and example code to shorten Bluetooth® development cycle
  • Shorten time-to-market with globally certified module partners
  • Wi-Fi support in the Infineon Developer Community (https://community.infineon.com/t5/Wireless-Connectivity/ct-p/wireless) with direct access to online applications support engineers
  • Industrial Temp Grade
Wi-Fi Features:
  • Wi-Fi 6/6E, Tri-band (2.4/5/6 GHz)
  • OFDMA, MU-MIMO, TWT, DCM
  • 2x2 MIMO or 1x1 SISO
  • 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
  • STA and Soft AP mode
  • Enhanced range, power savings, network efficiency features
  • Zero-wait TWT (target wait time)
Bluetooth® Features:
  • Bluetooth® 5.3 certified
  • Bluetooth® 5.2, 5.1, 5.0: All optional features
  • LE Audio and Auracast™ Broadcast Audio
  • LE- 2Mbps, Long Range , Advertising Extensions
  • SCO and eSCO
  • Complies with Bluetooth® core specification version 5.2
  • 20 dBm, 13 dBm, and 0 dBm TX path to optimize range and/or minimize power consumption
  • Best in class receive sensitivity up to -110.5 dBm
Coexistence:
  • Built-in advanced Bluetooth®/WLAN Coex
  • 2-wire SECI for external Coex
  • Bluetooth®/GPS/LTE radio

Modules and Development Kits

Developers can leverage regulatory certified, ready for production modules from Murata and Laird to avoid costly chip-down designs, take advantage of certifications for accelerated time to market, and get to production with connectivity software. Jumpstart your application development with ease by utilizing the Embedded Artist 2EA M.2 Module Evaluation Board.

  • Embedded Artists 2EA M.2 Module Eval Board

Embedded Artists 2EA M.2 Module Eval Board

M.2 Module Eval Board

The 2EA M.2 module, co-developed by Embedded Artists and Murata, is designed for evaluation, integration, and ease-of-use. The integration guide helps integrate an M.2 module into embedded designs and contains information about the M.2 standard and reference schematics.

Details:
  • Wi-Fi 6E, 802.11 a/b/g/n/ac/ax 2x2 MIMO
  • Bluetooth® 5.2 BR/EDR/LE
  • PCIe interface, in M.2 form factor (22 x 44 mm)
  • Chipset: Infineon AIROC™ CYW55573

Download the datasheet: https://www.embeddedartists.com/wp-content/uploads/2022/12/2EA_M2_Datasheet.pdf

Get the M.2 Integration guide: https://developer.embeddedartists.com/docs-m2/integration/introduction

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