AIROC™ CYW55513/2/1 Wi-Fi and Bluetooth® 6.0 Combo Devices

Infineon AIROC CYW55513, CYW55512, and CYW55511 Wi-Fi and Bluetooth 6.0 combo devices are designed to provide high-performance and reliable connectivity solutions for various applications, including IoT, smart home, and wearable devices. These devices go beyond the Wi-Fi 6/6E standard, offering powerful Wi-Fi capabilities that can efficiently handle congested networks.

The AIROC CYW5551x family of devices is characterized by their low power consumption and single-chip design. They support a range of Wi-Fi configurations, including 1x1 single-stream, tri-band (CYW55513), dual-band (CYW55512), and single-band (CYW55511). Additionally, these devices are Wi-Fi 6/6E compliant and feature an IEEE 802.11ax-compliant Wi-Fi MAC/baseband/radio. They also support Bluetooth and Bluetooth Low Energy (LE) 6.0.

The CYW55513/2/1 devices feature a Bluetooth 6.0-compliant subsystem designed to provide advanced Bluetooth capabilities. At the heart of this subsystem is a 192 MHz Arm® Cortex®-CM33 processor, which enables the devices to support a range of Bluetooth protocols and modes.

In terms of Bluetooth classic capabilities, the CYW55513/2/1 devices support basic rate (BDR) and enhanced data rate (EDR) for advanced audio distribution profile (A2DP) and hands-free profile (HFP) applications. Additionally, the devices support Bluetooth LE audio, which utilizes the LC3 codec.

The Bluetooth subsystem in the CYW55513/2/1 devices can operate in either hosted/controller mode or embedded mode. In embedded mode, the subsystem can offload the host processor, reducing the processing burden and improving overall system efficiency.

Furthermore, the CYW55513/2/1 devices support a range of Bluetooth LE extensions, including 2 Mbps, 1 Mbps, low-energy long-range (LR), and periodic advertising extensions. These extensions enable the devices to support a variety of use cases and applications that require low-power, low-latency Bluetooth connectivity.

Certified Modules and Development Kits

One of the key benefits of the AIROC CYW55513/2/1 devices is that they can significantly speed up development time, allowing companies to get their products to market faster. This is achieved through a broad array of module vendors, which provides greater flexibility and convenience. The Infineon global partner ecosystem enables development of IoT applications on time, on budget, and with minimized risk.

Applications

• Smart homes/IoT
• IP cameras
• Door locks
• Appliances
• Printers
• Speakers
• Gaming
• Cameras
• Wearables
• Smartwatches
• Fitness bands
• Industrial/medical
• Conference systems
• Automated meter readers
• Payment systems

Diagram

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