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Indium8.9HF Solder Paste
Solder paste from Indium provides high performance and reliability
The Indium Corporation Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Features
- Halogen-free per the EN14582 test method
- Low BGA, CSP, and QFN voiding
- Long stencil life and shelf life
- High transfer efficiency through small apertures (≤0.66 AR)
- Eliminates hot and cold slump
- High oxidation resistance
- Wets well to oxidized BGA and pad surfaces
- Excellent soldering performance under high-temperature and long reflow processes
- Clear, probe-testable flux residue
Applications
- Automotive
- Consumer
- Mobile
- Infrastructure
Published: 2025-10-08
