Indium Corporation

Indium8.9HF Solder Paste

Solder paste from Indium provides high performance and reliability

Image of Indium Indium8.9HF Solder PasteThe Indium Corporation Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Features
  • Halogen-free per the EN14582 test method
  • Low BGA, CSP, and QFN voiding
  • Long stencil life and shelf life
  • High transfer efficiency through small apertures (≤0.66 AR)
  • Eliminates hot and cold slump
 
  • High oxidation resistance
  • Wets well to oxidized BGA and pad surfaces
  • Excellent soldering performance under high-temperature and long reflow processes
  • Clear, probe-testable flux residue
Applications
  • Automotive
  • Consumer
 
  • Mobile
  • Infrastructure

Indium8.9HF Solder Paste

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
8.9HF SAC305 T4 NC BEST SELLERPASTEOT-800495-C0078.9HF SAC305 T4 NC BEST SELLER0 - Immediate$1,836.72View Details
8.9HF SAC305 T4 NC BEST SELLERPASTEOT-800495-C0058.9HF SAC305 T4 NC BEST SELLER9 - Immediate$1,836.72View Details
8.9HF SAC305 T5 NC BEST SELLERPASTEOT-801317-C0028.9HF SAC305 T5 NC BEST SELLER0 - Immediate$1,970.97View Details
Published: 2025-10-08